We are planning on using this device in an new design. This design must work in a High G environment. We are going to be potting the entire assembly. Are there any internal cavities in the TPS82130 including its inductor? Is everything encapsulated?
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We are planning on using this device in an new design. This design must work in a High G environment. We are going to be potting the entire assembly. Are there any internal cavities in the TPS82130 including its inductor? Is everything encapsulated?