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LM43603 - Double reflow soldering question

Other Parts Discussed in Thread: LM43603

Hello,

we usually mount components both on the top and the bottom side of the board.

The board will enter 2 times in the reflow oven. That means that some components will be thermically stressed 2 times.

The oven temperature is the typical temperature of a RoHS soldering process.

QUESTION:

Is the LM43603 controller suitable for a double reflow soldering process?

In other words, will the LM43603 converter be damaged if it enters 2 times into the reflow oven?


Best Regards,
Enrico Migliore

  • Hi Enrico,

    I'm looking into this and will get back to you shortly.

    Thanks,

    Anston

  • Hi Enrico,

    No it won't be damaged. Here is the reply from our manufacturing team:

    "

    This package designator is PWP and qualify as MSL2-260 C.

    Part of the package qualification is the required 4 reflow cycles.

    Three being on component level and the last one during board mounting for BLR.

    So basically this package is qualified for 4 times reflow.

    Some customers mount packages on the bottom of the PCB and reflow then
    mount other components on top side and go through second reflow.

    We normally recommended those customer to fabricate a fixture to hold the PCB
    during second reflow to avoid the second reflow causing any movement of
    component on the bottom side.

    "

    For further information regarding this please refer to 

    http://www.ti.com/lit/an/slma002g/slma002g.pdf

    Thanks,

    Anston