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LMZ10501SILT Package Dimensions and Layout Info

Other Parts Discussed in Thread: LMZ10501, LMZ20502

My customer is looking for the module dimensions and layout info on the LMZ10501SILT device. The datasheet does not have any of this info. The LMZ10501 Eval Board Users Guide, shows a typical layout but, no exact dimensions, etc.

  • As I understand the pinout and lend pattern for LMZ10501SILT SIL package  is the same as for LMZ10501SH NQB package. Difference only in the package itself.

  • In the online datasheet there is the link to the SIL package - MPDS483A (www.ti.com/.../mpds483) but it doesn't work.
  • You can find the SIL008 land pattern in the LMZ10502 datasheet: www.ti.com/lit/ds/symlink/lmz20502.pdf , pgs 29-31

    ~Leonard 

    added:  pdf attachedmpds483a.pdf

  • Hi, Leonard,
    I guess there is some mismatch in your explanation. LMZ20502 and LMZ10501 should have different land pattern.

    As I see according to the datasheet: for LMZ10501 ( SIL (8)) body size is 3.00mm x 2.60mm; for LMZ20502SILT ( USIP (8)) body size is 3.50mm x 3.50mm.

    But anyway in the file which you attached there is correct mechanical data for LMZ10501 SIL package.
  • Leonard,

    The package layouts shown in the LMZ20502 datasheet and the attached pdf file are different. Which one should the customer use for the LMZ10501SILT package? The datasheet has the data for the SIL0008F package, the attached pdf has data for the SIL0008A package.

    The datasheet just references a SIL package drawing.

    Thanks,

    John

  • Leonard,

    Can you confirm which package drawing the customer should use?

    Thanks,
    John
  • yes, sorry, I did not look at the physical dimensions of the LMZ20502, it is the larger package, so not applicable - please disregard! 

    The mpds483a file attached is the correct land pattern.  Also referenced in the LMZ10501SIL Eval Board Table 1 pg 2:

    U1 LMZ10501SIL SIMPLE SWITCHER SIL0008A  ( www.ti.com/lit/ug/snvu313/snvu313.pdf )

     

  • Hi, Leonard,

    Thanks for the reply. Just for info, could you mention what is the main difference between SIL0008 and NQB packages?
    I mean, TI produce LMZ10501SIL in the new package while IC with old package (LMZ10501SH) is obsolete. This mean that new package give some benefit. Could you mention which one?
  • Hello Oleksiy, 

    The SIL package has a different construction. The old SH package had an inductor on the bottom with the silicon ship mounted on top of it. The new SIL package has the silicon chip embedded in a substrate on the bottom with an inductor mounted on top.

    The SIL package has better thermal performance (the chip has direct copper connection to the PCB) and the die is not exposed. When the die is exposed (as in the SH package) additional care is needed in the mounting and handling process to ensure that the die does not get physically damaged when it is mounted and handled. This is mitigated by the SIL package construction because the die is embedded. Also, when the die has exposed edges there is a potential for light sensitivity. This is also mitigated by the SIL package construction. 

    I hope this helps. 

    Apologies for the package drawing issues in the datasheet. We are following up with our packaging folks to find out why the drawing was removed and fix the issue.

    Attached is the SIL0008A drawing for the SIL package for your reference. 

    LMZ10501SIL_Package_Outline_Drawing.pdf

    Cheers, 

    Denislav

  • Hi, Denislav.

    Thanks for your detail explanation for the LMZ10501SIL package.