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LMZ315xx series vs LMZ317xx series

Other Parts Discussed in Thread: LM3150, LMZ31710, LMZ31503

I am designing power circuitry for use with a Xilinx FPGA, and I came across two families of power modules, the LMZ315xx (viewed 31506, 31503) series and the LMZ317xx (viewed 31710,31707,31704) series. 

My first question is what are the design choices that would drive picking one family of power modules over the other.

My second question is what are the benefits of choosing a chip like the 31707 (7A) over the 31710 (10A) (I understand they could be priced differently, but that is not a concern in my case).

  • On a side note, how do the above compare with the LM3150? This chip appears far more efficient, which will limit the heat generated by the chip, and if it could replace the chips mentioned above, seems like a great power component.
  • The LMZ31710 has a 10mmx10mm footprint, 4.3mm height, with current ratings up to 10A. (7A & 4A footprint compatible)
    The LMZ31503 has a 9mmx15mm footprint, 2.8mm height, with current rating up to 6A. (3A footprint compatible)
    The only difference for 7A vs 10A device is the current limit protection. The current limit thresholds are set lower for the lower current devices.
  • The LM3150 is a controller which requires external FETs, inductor and other passives. The LMZ3 devices are power modules which include the FETs, inductor and many passives internal to the device.