Other Parts Discussed in Thread: TPS3852-Q1, TPS3852, TPS3850
This question is the continuation of the following E2E.
e2e.ti.com/.../2269548
Michael-san
Thank you for reply.
I have some questions.
It is confirmation about TPS3850-Q1.
Q1.
The package size is described on pages 36 and 43 of the TPS3850-Q1 datasheet.
Which page is correct information?
(I think the information on page 36 is correct. I think the information on page 43 is a mistake.)
Q2.
On page 36 of the datasheet, the chamfer size is stated as "OPTIONAL".
Does the thermalpad of the TPS3850-Q1 surely have a chamfer?
(Is there a rectangular thermal pad too?)
It is confirmation about TPS3852-Q1.
The TPS3852-Q1 datasheet does not contain information on the dimensions and shape of the thermalpad.
("THERMAL PAD SIZE AND SHAPE ON SEPARATE SHEET" is stated on page 29 of the datasheet, but there is no such separate sheet.)
Also, the land pattern information is not described.
Q3.
On page 30 of the TPS3852 datasheet, thermalpad dimensions and shapes are described.
Is TPS3852-Q1 the same as this?
Q4.
On page 30 of the TPS3852 datasheet, LAND PATTERN DATA are described.
Is TPS3852-Q1 the same as this?
Q5.
> We do not provide the chamfer specifications for this device.
> If we don't provide dimensions of the chamfer, then you can use a simple rectangle shape rather than a shape with chamfer.
From the above answer, I understood that the thermalpad shape of TPS3852-Q1 is a rectangle.
(That is, there is no chamfer.)
Is it correct?
*
I am referring to the following datasheet.
TPS3850-Q1 :SBVS264A
TPS3850 :SBVS301A
TPS3852-Q1 :SBVS285
TPS3852 :SBVS302
-Harukawa