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TPS3808: TPS3808G33DRVR junction to board thermal resistance

Aaron Spaete
Expert 4275 points
Part Number: TPS3808

Team,

My customer has the following question.

Clarification of Thermal properties

Hello, I am looking for clarification of the thermal properties for the WSON package for the part number TPS3808G33DRVR. The datasheet states that the Thermal Resistance Junction to case bottom is 7.3C/W but the thermal resistance junction to board is 135C/W. I am confused how the junction to board resistance is so much larger than the Junction to case bottom when the package has a thermal pad on the bottom. Can you confirm the junction to board thermal resistance?

Regards,

Aaron

  • 0
    TI__Genius 12630 points

    Aaron,

    I believe this to be correct. The thermal resistance from junction to case bottom should be lower than the thermal resistance from junction to board. The case bottom has the thermal pad as you mention which reduces the thermal resistance. When I look at other devices with the same package with thermal pad, the numbers suggest the same in that the junction to case thermal resistance is much lower than the junction to board thermal resistance. I should also point out that other packages with no thermal pad have N/A for junction to case bottom thermal resistance which suggests that adding the thermal pad reduces thermal resistance for junction to case bottom.

    -Michael