Hi,
what is the recommended drill size for the vias residing on certain pads of a printed circuit board that will accept the BQ51013YFF. Do the vias have to be filled before applying the solder paste on the pads. If yes, what is the preferred filling material (resin, solder or other).
Thanks
Robert2787
The below post in the forum covers may of the questions.
http://e2e.ti.com/support/power_management/wireless_power/f/693/t/142205.aspx
B/R
Bill
Best Regards,
Bill Johns, Applications Engineer
bqTESLA Wireless Power Products
Texas Instruments Inc
Dallas, Texas
Thanks Bill,
As you said, this reference gives me many of the answers that I am looking for.