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TI Home » TI E2E Community » Support Forums » Power Management » Wireless Power » Wireless Power Forum » Drill size of vias under pad on the BQ51013YFF
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Drill size of vias under pad on the BQ51013YFF

Drill size of vias under pad on the BQ51013YFF

This question is answered
Robert2787
Posted by Robert2787
on Feb 23 2012 08:10 AM
Intellectual565 points

Hi,

what is the recommended drill size for the vias residing on certain pads of a printed circuit board that will accept the BQ51013YFF. Do the vias have to be filled before applying the solder paste on the pads. If yes, what is the preferred filling material (resin, solder or other).

Thanks

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  • Bill Johns
    Posted by Bill Johns
    on Feb 23 2012 14:10 PM
    Verified Answer
    Verified by Bill Johns
    Genius12330 points

     

    Robert2787

    The below post in the forum covers may of the questions.

    http://e2e.ti.com/support/power_management/wireless_power/f/693/t/142205.aspx

     

    B/R

    Bill

    Best Regards,

    Bill Johns,  Applications Engineer

    bqTESLA Wireless Power Products

    Texas Instruments Inc

    Dallas, Texas

    bq51013
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  • Robert2787
    Posted by Robert2787
    on Feb 23 2012 15:35 PM
    Verified Answer
    Verified by Robert2787
    Intellectual565 points

    Thanks Bill,

    As you said, this reference gives me many of the answers that I am looking for.

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