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TI Home » TI E2E Community » Support Forums » Power Management » Wireless Power » Wireless Power Forum » All Tags » bq51013
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Welcome to the Wireless Power Section of the TI E2E Support Community. Ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers. To post a question, click on the forum tab then "New Post".

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bq51013
  • Bill John
  • bq25046EVM
  • BQ500110
  • bq500110EVM
  • BQ500210
  • bq500210EVM-689
  • bq51011
  • bq51013 outputpower
  • bq51013 efficiency
  • bq51013 qi wireless power wpc bq500210
  • bqTESLA
  • BQTesla 150
  • bqTESLA EVM
  • bqTesla100LP
  • bqTesla100LP bqTesla150LP
  • power
  • QI
  • Qi Wireless charger inductive charger
  • Texas Instruments
  • wireles power
  • wireless
  • Wireless charging
  • wireless power
  • Wireless power consortium
  • WPC
Related Posts
  • Forum Post: bqTESLA FAQ

    Bill Johns Bill Johns
    TI Wireless Power Web Page: Information on TI Wireless Power Products. http://www.ti.com/ww/en/analog/wireless_power_solutions/index.shtml Introduction to WPC: See "Introduction to the Wireless Power Consortium Standard" http://focus.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber...
    on Apr 5, 2011
  • Forum Post: Re: cad files

    Michael Day Michael Day
    Thank you for your interest in this product. You can click on "symbols and footprints" in the tool folder to find all available symbols and footprints. Additional symbols and footprints can be requested in the development tools/analog elab forum http://e2e.ti.com/support/development_tools/analog_elab_and_tools...
    on Apr 25, 2011
  • Forum Post: General Qs from customers regarding BQTesla 150 solution

    Daniel Siroky Daniel Siroky
    Normal 0 false false false EN-US X-NONE X-NONE MicrosoftInternetExplorer4 ...
    on Jun 2, 2011
  • Forum Post: Re: bq51013 protection features

    Masaya Emi Masaya Emi
    Here is one specific question from our customer. Please assume a case where WPC complicant Tx controller is stuck and keep its Power Transfer regardless of End of Transfer Packet. Does bq51013 has features to stop transmitting power from Tx to Rx in case of failure? For example............ A...
    on Aug 14, 2011
  • Forum Post: Re: BQ500110 coil_pwm problems

    dean k dean k
    Hello Vladimir and thank you very much for your informative response. Now that i know the BQ500110 seems to be switching the coil correctly, I have moved onto debugging the reviever side/communication channels. When I first place my reciever on the transmit coil (there is about 5mm spacer between...
    on Aug 23, 2011
  • Forum Post: BQ500110 coil_pwm problems

    dean k dean k
    Hello E2E community, I am currently debugging a design based on the BQ500110-EVM and the BQ51013-EVM. When I apply power to the BQ500110 and probe the COIL_PWM pin I do see the three 100kHz pulses except they occur every 0.4 sec instead of 0.5 sec (EVM user guide states it should be 0.5 sec...
    on Aug 22, 2011
  • Forum Post: Re: Bigger package for BQ51013

    Bill Johns Bill Johns
    --The device is planed to be released in early 2012. Engineering samples are available at this time, but quantities are limited. You will need to contact your local TI sales representative for more information.
    on Aug 31, 2011
  • Forum Post: Re: bqTESLA minium power transfer

    Bill Johns Bill Johns
    The bq51013 does NOT have a min power termination; the device could operate at a low or no load current. We do have options for terminating the device at low current using an external circuit or future spin of the device. Best Regards Bill
    on Sep 1, 2011
  • Forum Post: Re: bq51013 Power Dissipation

    Bill Johns Bill Johns
    To improve efficiency and provide good load transient response voltage into the LDO (V-RECT) will change with output current. This will result in a change in efficiency as load changes, improving as load increases. Also below 225mA the synchronous rectifier is operating in a half synchronous mode...
    on Sep 2, 2011
  • Forum Post: Re: bq51013 termal resistance

    Bill Johns Bill Johns
    1.) Thermal Metric for bq51013 YFF (Die Size Ball Grid Array) on data sheet page 3. Thermal resistance from Junction to Case (Top) of package is 0.2 C/W. For the YFF package the Case Top is the die substrate, thermal resistance will be very good. But from a practical stand point cooling will only...
    on Sep 5, 2011
  • Forum Post: Re: bq51013 termal resistance

    Michael Day Michael Day
    Thermal resistance is calculated using the high K board (2s2p)
    on Sep 9, 2011
  • Forum Post: Re: bq51013 YFF package layout guidelines and PCB manufacturing design rules

    Bill Johns Bill Johns
    1.) Recommended pad—See attached PDF file---Also the bq51013 (YFF) footprint on the EVM (HPA725) used a Non-Solder Mask Defined Pad size is 10mil / 0.254mm, with mask clearance of at 12mil / 0.305mm 2.) We have used 6 mil drill hole in pad then plated over for flatness. See below table for pins...
    on Nov 1, 2011
  • Forum Post: BQ51013 - PCB coil

    Ido Baruch Ido Baruch
    Hello, I want to insert the coil circuit as one of the layers of the PCB is it possible? What is the minimum inductance of the coil (for 100 - 200mA ) ? Can I get examples of these coils ? Thank you, Ido
    on Nov 20, 2011
  • Forum Post: Re: Qi devices transmission range

    Bill Johns Bill Johns
    Hello Moshe The distance of 12cm is a little far for the present WPC standard. It may be possible to transfer some power but also the receiver has to send commands back to the transmitter through load modulation. If receiver cannot communicate with the transmitter power transfer will stop. The...
    on Feb 9, 2012
  • Forum Post: Re: bq51013EVM-725 unable to work with transmitters

    Bill Johns Bill Johns
    Hello Lingyu Sorry you are having problems with the Gen2 kit along with the Gen1 kit. Could you look at the 19V input to the transmitter EVM. Verify that it is solid with now dips, voltage must be 19V +/- 1V. Some customers have had problem with input power supplies entering current limit during...
    on Feb 13, 2012
  • Forum Post: Re: bq51013EVM-725 unable to work with transmitters

    LINGYU LIU LINGYU LIU
    Hi Bill, I have tested the input voltage supply with scope. The result is: 1. Average high and low are both 18.5V 2. Max high is 19V, and min low is 17.9V So I think the input voltage supply should be stable. And the thing is I have tested the two generations of transceiver kits with different...
    on Feb 13, 2012
  • Forum Post: Re: bq51013EVM-725 unable to work with transmitters

    LINGYU LIU LINGYU LIU
    Hi Bill, Finally solved, the JP3---TS did not connect to DIS. After connecting them, the receiver works. I have received all your new kits, and I will try out later, hopefully could get positive results. Thank you !
    on Feb 13, 2012
  • Forum Post: Re: bq51013EVM-725 unable to work with transmitters

    Bill Johns Bill Johns
    Very good. JP3 controls the external temp sense option of the bq51013. With shorting jumper in the DIS position a fixed resistor is use to set value of the TS pin to a safe value with no input or connection to J5, TS connection. With shorting jumper in the EN positions an external NTC thermistor connected...
    on Feb 13, 2012
  • Forum Post: bq51013EVM-725 unable to work with transmitters

    LINGYU LIU LINGYU LIU
    Hi, Currently I am testing on the new generation of wireless power transfer kits: bq51013EVM-725 & bq500210EVM-689. Previously I tested on gen 1 (bq25046evm&bq500110evm) also. When I tested on the new two kits (bq51013EVM-725 & bq500210EVM-689), I have set input power of 19V, 0.5A max...
    on Feb 13, 2012
  • Forum Post: Re: Drill size of vias under pad on the BQ51013YFF

    Bill Johns Bill Johns
    Robert2787 The below post in the forum covers may of the questions. http://e2e.ti.com/support/power_management/wireless_power/f/693/t/142205.aspx B/R Bill
    on Feb 23, 2012
  • Forum Post: Re: bq51013 YFF package layout guidelines and PCB manufacturing design rules

    Bill Johns Bill Johns
    Matt For a non-solder mask defined pad and Bump Diameter of 0.250mm (9.84mil) the recommend copper pad is 0.230mm (9.05mil) and solder mask opening 0.310mm (12.2mil). This is based on slide 4 of the attached presentation. But consult you PCB manufacturing house regarding their capability and experience...
    on Feb 28, 2012
  • Forum Post: Re: bq51013evm-725 design

    LINGYU LIU LINGYU LIU
    Hi Bill, What I want is to re-draw and re-make this PCB board of the bq51013EVM-725, it is good if you can provide me the orginal ".pcb" and ".sch" files instead of PDF version, so that I can use software to re-design it. And one more thing is regarding the IC chip (bq51013YFF...
    on Mar 19, 2012
  • Forum Post: Re: bq51013evm-725 design

    LINGYU LIU LINGYU LIU
    Hi Bill, I have viewed the gerber files and for re-design purpose, what I need is the original schematic file instead of PDF file since it is not possible to convert PDF to .sch file. Pls send me a copy of original schematic file of the bq51013EVM-725 if possible. Thank you. Regards,
    on Mar 20, 2012
  • Forum Post: Re: bq51013evm-725 design

    Bill Johns Bill Johns
    I have emailed you the design files. Bill
    on Mar 20, 2012
  • Forum Post: Re: bq51013evm-725 design

    LINGYU LIU LINGYU LIU
    Hi, I am not able to open the files since somehow they are invalid. Could you send them again and maybe you can try to open them before sending to me? Thank you. Regards,
    on Mar 20, 2012
12
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