HelloCustomer support directed me to this forum, since they weren't able to help. So I'm asking the question here again. We are currently developing a propietary rf application. Since we have to get the radio-signals through rough/difficult environments we evaluated OFDM in the 433-ISM Band (or 868). Ideal would be the MR-OFDM physical layer of to the IEEE 801.15.4.g SUN specification.
Sadly there is only one module of a different company on the market at the moment. with a little help of google I found following presentation (Wireless Connectivity, LPRF Performance Line, CC1120 and CC1200 families from Q1 2013)
Citation from Slide nr. 37 : "TI will provide high performance and power efficient 802.15.4g compliant solutions using the MR--FSK and MR-OFDM PHY specifications".
This presentation is 6 years old and today I didn't found a product of yours, which supports MR-OFDM. Are those chipsets still in development and will there be MR-OFDM compliant chips any time soon or is this presentation outdated and the development of such chips was shut down?
Looking forward to your answer
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.