I'm designing a board using the CC1101-CC1190 reference design (swrr077), and I'm confused about what landing pattern to use for each component.
The CC1101 datasheet, on page 27, shows a landing pattern with a solder mask covering approximately half of the thermal pad, tenting the vias on the top layer. The recommended landing pattern at the end of the document shows no tenting, and more vias.
The CC1190 datasheet only shows one landing pattern, at the end of the document.
I'm leaning towards using the landing pattern shown on the CC1101 datasheet, page 27, for both parts (with modifications to make it work for the dimensions of the CC1190), however, I'm concerned that the thermal properties of a partially soldered thermal pad might cause issues (especially with the CC1190). The reference design shows that vias are tented on the bottom, and there is no solder mask over the thermal pads.
I'm split between my two options, and want to make sure everything will solder nicely using a hot air station. Which landing patterns should I use?
Richard D. Reavis
The best is to use the landing pattern we have used in the reference designs that could be found under www.ti.com/products/CC1190 (http://www.ti.com/litv/zip/swrr075)
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