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DRV5055: Orthogonality and parallelism of sides.

Nathan Pettinger
Prodigy 30 points
Part Number: DRV5055

How orthogonal is the sensing direction to the top/bottom of the sensor? What is the parallelism of those two sides?

  • 0
    TI__Genius 17990 points
    Hello Nathan,

    Thank you for using the TI forum. What do you mean the the "parallelism of those two sides"?
  • 0 in reply to Mitch M
    Prodigy 30 points
    I'm trying to find out the range of error in degrees between the sensing direction and top and bottom of the sensor. An example would be like "bottom face is 90 degrees + or - 0.2 degrees." etc. I'm also wondering what the range of error is between angle of the two parallel surfaces, top and bottom.

    Thank you!
  • 0 in reply to Nathan Pettinger
    TI__Genius 17990 points
    Hello Nathan,

    I think I see what you are asking now. I think I can help answer your questions by explaining more how the Hall device works. The DRV5055 is sensitive to a magnetic field orthogonal to the top and bottom of the package. If the magnetic filed is at an angle to the package, then the sensor will respond only to the orthogonal component of that magnetic field. It will then output a voltage based on the strength of the field present (or rather, the strength of the orthogonal portion of the field). Because it is based solely on the magnetic filed, the sensor responds the same if the magnet is at the top or bottom of the package, based on North or South polarity.
  • 0 in reply to Mitch M
    Prodigy 30 points
    That sadly does not answer my question. I understand how the sensors work. However, I do not know the tolerances of the orientation of the Hall element with respect to the surfaces of the package. Unfortunately in real life nothing is perfectly orthogonal, level, perpendicular, or parallel; there is always some degree of inaccuracy. I am needing to know what that degree of inaccuracy is. In machining you have a tolerance usually stated as +/- a number of degrees or unit of distance, and that is the type of information I am looking for.

    Thank you!
  • 0 in reply to Nathan Pettinger
    TI__Genius 17990 points

    Hello Nathan,

    Unfortunately I do not have access to manufacturing tolerance data. That being said, if I look at the die size inside the package and presume the worst case scenario of the die being all the way down on one end and raised to the maximum level on the solder on the other end then that would create about 0.6° of tilt from the package floor where the die is attached. However, this is an estimate of a worst case scenario, and it will usually be much better than that. It is also important to note that from some brief testing that I did, the error from this tilt would be roughly 0.3mV on the output, which is minimal compared to the combined errors from sensitivity variance/errors and noise.