I have a situation that i am placing the HDC1080 along with another component that must be sent through a special wash process to remove all flux residues. We opted to run the PCB through our SMT reflow oven and then through the was process without the HDC1080. I am now working on placing the HDC1080. We have a BGA rework station as well as reflow ovens. would it be better to place the part and rerun it through the SMT reflow or use the BGA rework station. I am concerned bout the concentrated heat of the rework station and the possible need for touch-up after either of the processes. Has anyone had any experience with this?
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