• State Resolved
  • Locked Locked
  • Replies 5 replies
  • Subscribers 33 subscribers
  • Views 1977 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

HDC1010: soldering

K.Yaita
Guru 29690 points
Part Number: HDC1010
Other Parts Discussed in Thread: HDC1080

Hi Team,

The datasheet page 18 shows the following.

>The HDC1010 should be limited to a single IR reflow and no rework is recommended.

I heard it is difficult to consider HDC1010 because it should be limited to a "single" IR reflow from my customer.
Could you tell me the background of the "single" requirement?

Best Regards,
Yaita

  • 0
    TI__Expert 5695 points
    Our Humidity Applications Engineer will contact you shortly
  • 0
    TI__Expert 5145 points
    Dear Yaita-san,
    the second reflow it is not recommended because can produce a collapsing of the CSP balls, with the consequence that the sensitive element comes into direct contact with the PCB. In this situation the humidity sensor is no longer able to correctly measure the humidity conditions of the environment but only those of the PCB itself.
    Please let me know if this replies to your question.
    Best regards,
    Carmine
  • 0 in reply to Carmine Iascone
    Guru 29690 points

    Hi Carmine-san,

    Thank you for your support.
    It seems HDC1080 (WSON with topside sensor) is the same.

    (datasheet page 18)
    >The HDC1080 should be limited to a single IR reflow and no rework is recommended.
    http://www.tij.co.jp/jp/lit/ds/symlink/hdc1080.pdf

    May I have your comments for HDC1080?

    Best Regards,
    Yaita

  • 0 in reply to K.Yaita
    TI__Expert 5145 points
    Hi Yaita-san,
    with the HDC1080 instead, the problem is related to the plastic package. During the soldering, the package produces a drift in the accuracy of the device, which we already take it in account during our factory calibration. If a second reflow is done, the further package shift needs to be compensated by the customer in his software.
    Please let me know if it is clear enough.
    Best regards,
    Carmine
  • 0 in reply to Carmine Iascone
    Prodigy 10 points

    Dear Carmine,

    We are having some problems with assemble HDC1010.

    We have followed the instruction in datasheet about

    - No clean solder paste

    - Use pick and place machine

    - Follow same temperature profile

    - Single IR reflow

    - No board wash - we did some minor cleaning for TH components using brush & alcohol but those are far away from the IC.

    Moreover, we did the PCBA in a BGA factory with XRay facilities, we checked the solder quality and alignment. All look good.

    However, we only have a success rate of 80%. (1 fail every 5 boards). Failure mode is due to humidity sensor reporting wrong value (RH = 0 & temperature = 127)

    I am now wondering if this is due to the IC already damaged by the time we received or due to mishandle of the IC. We could not think of any other thing that could have gone wrong. Is there anyway we could check for this? Would you please advise on how to robustly assemble HDC1010 & to handle them?