In the hardware design guideline, there is one picture to show the through vias, and there are 2 kinds of drawing (please see the below attach picture, circle in red). Are these 2 through vias with different SPEC requirement, or they are the same?
This document doesn't explain difference of these 2 vias.
Sorry, I used copy/paste but the pic not shown. Please see the attach again.
Hello Jesse,
If you look at the hardware design checklist: 
You will see that there are two via types:
| Through hole via dimensions | 12.2 mils drill 22.4 mils pad |
| Blind via dimensions (L1 - L2) | 5.9 mils drill 13.77 mils pad |
There is only 1 through hole via type.
Regards,
Adrian
