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  • TI Thinks Resolved

OPT9221: Designing a PCB footprint for OPT9221

Part Number: OPT9221

I would like to design my own 3D Time-of-Flight camera using TI's solution chipset, mainly as a personal project for learning purposes. However, while I was designing the PCB footprint for the controller, I came across the terms "collapsing" and "non-collapsing" for the types of balls a BGA package can have, each having different requirements in terms of the size of the pads. So my questions are 1) does TI by any chance have ready footprints for the solution chipset? And 2) would designing the footprint using the exact dimensions listed in the mechanical description in the datasheet work?

  • Hi Mary, please submit your PCB footprint request to ti-3dtof@list.ti.com. They will be able to help you there.

    -Larry
  • Hi Mary,

    We sell evaluation modules for the chipset for you to experiment on. If it is a one time personal project, it may be easier to just purchase an evaluation module. Link is here: www.ti.com/.../opt8241-cdk-evm
    We have published the Evaluation Module schematics, physical design files and gerbers at the following link: www.ti.com/.../sbac138
    The footprint is a part of the physical design files with the extension *.brd. You can easily export the footprints from the brd file. Following link describes how to do the same: community.cadence.com/.../11515
    If you want to start afresh and make your own footprint, you can refer to the datasheet. Following datasheet recommendations is what we also do to make our Evaluation modules and it works for us.

    Regards,
    Subhash

    3D ToF Product Landing Page

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