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OPT9221: Designing a PCB footprint for OPT9221

Part Number: OPT9221

I would like to design my own 3D Time-of-Flight camera using TI's solution chipset, mainly as a personal project for learning purposes. However, while I was designing the PCB footprint for the controller, I came across the terms "collapsing" and "non-collapsing" for the types of balls a BGA package can have, each having different requirements in terms of the size of the pads. So my questions are 1) does TI by any chance have ready footprints for the solution chipset? And 2) would designing the footprint using the exact dimensions listed in the mechanical description in the datasheet work?