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TMP006.c questions

1.     from  52 column of "tmp006.c"  , if no "CONFIG_FPU" define,then "fixed-point version" can`t be compiler  ,     how to  modify the "sample code" to use ? 

2.      from  52 column of "tmp006.c"  ,,the unit is percent of K" ?  [K] = [oC] + 273.15。

3.   from  52 column of "tmp006.c","fixed-point version" means no recommand for use?

4.   in "sbos518c.pdf" page .10,TAMBIENT means "local die temperature" or "object temperature"?

how`s different of "die temperature"、"object temperature"  "ambient temperature?

5.   "TEMPERATURE REGISTER" means the temperature on die ?

6.   do "SENSOR VOLTAGE REGISTER" compensate objective?

7.  Whta`s the S0 : Calibration factor (should be calibrated) ?

const struct tmp006_t tmp006_sensors[TMP006_COUNT] = {

        /* TODO: Calibrate sensitivity factors. See crosbug.com/p/9599 */

        {"Heat pipe D", TEMP_HEATPIPE_ADDR, 2771},

        {"PCH D", TEMP_PCH_ADDR, 14169},

        {"Memory D", TEMP_MEMORY_ADDR, 6400},

        {"Charger D", TEMP_CHARGER_ADDR, 10521},

        {"DCJack C", TEMP_DCJACK_ADDR, 6400},

        {"USB C", TEMP_USB_ADDR, 6400},

        {"Hinge C", TEMP_HINGE_ADDR, 6400},

        {"SD Card D", TEMP_SDCARD_ADDR, 6400},

};

  • Hi Philip,

    Thank you for you questions regarding TMP006.  Here are the answers to most of your questions....

    4) TAMBIENT on page 10 is the same as the die temperature (TDIE) of the TMP006 IC.

    Generally speaking TAMBIENT refers to the temperature of the environment...think of this as the temperature inside of a room or the inside of the enclosure of your equipment.  TDIE is the actual temperature of the TMP006 silicon.  In a perfect application this woul dbe the same as TANIENT.  In reality you may have other sources of heat on your PCB, such as a microprocessor.  If the TMP006 is connected thermaly to a source of heat on the PCB then the TDIE will be a little higher than TABIENT.  TOBJECT is the average temperature of the scene inside the field of view of the TMP006.  In a perfect application the desired obeject will have perfect temperaure uniformity within the entire field of view of the TMP006...in this case the TOBJECT is simply the average temperature of the "object"...in reality if there are more than one object within the field of view of the TMP006 the TOBJECT will be the average of what is within the view of the TMP006 sensor.

    5) Temperature register on TMP006 is referring to the TMP006 die temperature.

    6) The sensor voltage is the output of the TMP006 thermopile.  This is a read only register that is used to determine the object temperature based upon all of the equations.  Please refer to TMP007...it is a new product with the same sensor but takes care of all of the calculations and simplifies the temperature measurement process.  The output from the TMP007 is both the die temprature and object temperature. 

     

    7) Please refer to this document regarding calibration:

    http://www.ti.com/product/TMP007/technicaldocuments