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IR Temperature Sensor FAQ

This is a FAQ to address the common questions asked about Texas Instruments IR Temperature Sensors, the TMP006 and TMP007. The data sheets provide a good base for parametric specifications, but TI also has several supporting documents (like the TMP007 Layout and Assembly User Guide (SBOU143)) and resources (like the TMP007EasyCalEVM) to help with your application implementation.

Literature for the TMP007 can be applied to the TMP006 with the understanding that the TMP006 has no integrated math engine and the processing will have to be done on a host controller.

Regarding calibration, the TMP007 Calibration Guide (SBOU142) provides methods and insight into the TMP006 and TMP007 calibration process.

There are three EVMs available for IR Temperature Sensing:

  • TMP006EVM
  • TMP007EVM
  • TMP007EasyCalEVM

TI Application Note SLVA704 is an excellent reference for I2C questions.

The FAQ section below will grow with time. 

FAQ #1

Question: Why is the TMP006/007 PCB footprint so important?

Answer: The footprint is all about equalizing the temperature of the PCB and the TMP006/TMP007 die.  The recommended footprint is designed to slow transient temperature spikes on the board caused by other heat sources on the board.  Typically, slow ambient temperature changes are not a problem as the die and PCB temperatures move together. 

 

FAQ #2

Question: What effect do the PCB and die temperatures have on the output?

Answer: The TMP006 and TMP007 are thermopile-based sensors.  In essence, a thermopile reacts to IR from 360° around it, so if the PCB is even 2°C different than the die, the thermopile reacts and produces what we call an offset.  A basic rule of thumb is that if the die temperature (also known as Ltmp) is the same as the board and the same as any field-of-view restricting lid, offsets will be minimized.  More information on footprint benefits and transient correction are in the works. See the TMP007 Layout and Assembly User Guide (SBOU143) for more information.