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TMP006 sensor

MD NAHIDUR RAHAMAN
Intellectual 275 points
Other Parts Discussed in Thread: TMP006, TMP007

Hi

I thinking to use tmp006 for my project.

The problem is sensor can’t detect the low temperature as well as TMP006 EVM have same. I put one object in to the freeze at -10 degree C until 10 minutes and after I was measured temperature by TMP006 EVM and TMP006 Breakout board and both sensor was shown object temperature >10 degree C. But both sensor can detect hot temperature.

In TMP006 datasheet its said that sensor can detect temperature from ±1.5°C (max) from –40°C to +125°C.

What is mean by ±1.5°C?

This value i used during the program.

#define TMP006_B0 -0.0000294

#define TMP006_B1 -0.00000057

#define TMP006_B2 0.00000000463

#define TMP006_C2 13.4

#define TMP006_TREF 298.15

#define TMP006_A2 -0.00001678

#define TMP006_A1 0.00175

#define TMP006_S0 6.4  // * 10^-14

 

Thank you for help and support.

 

Sincerely,

MD NAHIDUR RAHAMAN

  • 0
    TI__Intellectual 1811 points

    MD Nahidur,

      Some things to take into concideration.  The TMP006 with out any field of View restiction has nearly a 180° field of view.  Is the cold object  100% of the field of view?  The sensor esentially averages the temps in it's field of view.  So if your object is say 50% of the field of view and the rest in room temp, it will average your temp to something like middle of room temp and object temp.  You can improve your field of view issures by restricting the field of view with a shield or moving the device closer to the object.  Also putting The object in the -10°c  it doesn't necesarrily mean that your object  is -10°C when you bring it out, and it will heat up quickly depending on the material.  So a reference probe would be nice to verify it's exact temp. 

      The +/- 1.5°C means that the error from the TMP006 may be as much as 1.5°C off either hi or low.

      I hope this helps.  Please let me know if there is anything else I can help with.

    Regards,

    Tommy Santoyo

    Texas Inst.

    Sensing Apps Team

     

     

  • 0 in reply to Tommy Santoyo
    Intellectual 275 points

    Hi Tommy,

    Thank you for useful suggestion. What is the best way to verify the tmp006? I am concern about low temperature.

    I have confusion about below coefficient. I don’t understand how to calculate those coefficient values. Do I need to change those coefficient values?

    TMP006_B0 -0.0000294

    TMP006_B1 -0.00000057

    TMP006_B2 0.00000000463

    TMP006_C2 13.4

    TMP006_TREF 298.15

    TMP006_A2 -0.00001678

    TMP006_A1 0.00175

    TMP006_S0 6.4 // * 10^-14

    Sincerely,

    MD NAHIDUR RAHAMAN

     

  • 0 in reply to MD NAHIDUR RAHAMAN
    TI__Intellectual 1811 points

    MD Nahidur,

          It will be helpful for you to review the TMP007 calibration guide.  This explains the process of calculating the correct coefficients for your system.  The calibration is really a system calibration.  It is very sensitive to the field of view, and the distance of the device from the object, and the objects affect on the TMP006/TMP007 die temperature.  This device is designed for a fixed distance and fixed field of view.   We have an EVM available TMP007EasyCal EVM which comes with a reference temp sensor and easy to use software. 

    Regards,

    Tommy Santoyo

    MHRS Sensing Apps Team

  • 0 in reply to Tommy Santoyo
    Intellectual 275 points

    Hi Tommy,

    Thank you for answer. I did measurment by tmp006 and refreence IR thermometer and i got almost same result. My problem is solved. Can you help me to verify my tmp007 layout. I have designed tmp007 footprint by altium designer and during design i tried to follew TMP006 and TMP007 Layout and Assembly Guide. Is it possible to get your email address so that i can send you altium file.

    Thank you for help.

     

  • 0 in reply to MD NAHIDUR RAHAMAN
    TI__Intellectual 1811 points

    MD Nahidur, 

     

        I would be glad to help guide your layout efforts.  The layout guides are all base on trying to keep the PCB under the die at or as close to the same temperatue as the die as possible.  When die and PCB are at different  temps this causes offset.  One thing we can do is tie the address pins to ground if you are not using multiple die on the same bus.  Also it is best to extend  ground around the vias as in the attached.  I've attached a layout that may help.  Although in this layout, ADD1 and ADD0 are not tied to ground it is best if they are.  I've drawn that  in Red pen.  It is also helpful to know if you have power dumping components on your baord. and what temperature range you expect your PCB to be in at any given time.  Look forward to hearing from you. 

    Regards,

    Tommy Santoyo

    MHRS  Sensing Apps