Infrared Temperature Sensing Technology enables non-contact temperature measurements. Other methods of temperature measurement require the temperature transducer to make physical contact with the object of interest.
All objects above zero kelvin (-273.15C, -459F) radiate energy proportional to their temperature. This relationship is defined by the Stefan-Boltzmann Law. An IR Temperature Sensor, or pyrometer, absorbs the radiated energy in order to measure it. The TMP00x devices contain a thermopile which absorbs this energy and reports a corresponding voltage in the Sensor Voltage Register 0x00. Additional information is needed to convert this voltage to a temperature. See “What is Cold Junction Compensation?” for more information.
Thermocouple operation is described by the Seebeck effect. Two metals are chosen such that a voltage proportional to temperature is developed at their junction. One such junction, known as the hot junction, is used as the temperature sensor. There will be another, unavoidable, junction at the point where the thermocouple wiring connects to the measuring circuit. This junction is known as the cold junction. The voltage developed at the hot junction is dependent on the temperature of the cold junction, so it is necessary to measure the temperature of this cold junction by another means. In TMP00x devices, the hot junction and cold junction are integrated on a single MEMS device. The temperature of the cold junction is measured using an on-board semiconductor temperature sensor, and reported as Tdie Local Temperature Register 0x01.
A thermopile is several thermocouples connected in series.
No, TMP00x is a single chip MEMS device. The thermopile is constructed in the center, and the supporting electronics (ADC, local temp sensor, digital logic) are implemented in the area surrounding it.
TMP00x is primarily deployed in applications with distances less than six inches. The maximum distance is dependent on system design. In an experiment using a crude Fresnel lens with the Thru-Hole Layout, we observed a thermopile response to a human body six feet away.
The Object Temperature accuracy of TMP00x devices is specified as +/-1°C typical and +/-3°C max. This is given for a Die Temperature between 20 and 40°C, and an Object Temperature between 20 and 60°C. This specification is based on data collected in a reference system, with the TMP00x used in the Top View/No Shield Layout, and may not reflect performance in a given application.
The relationship between radiated energy received and actual object temperature varies based on several system parameters.
A one-time calibration is necessary to establish the coefficients needed for a given system design. The default coefficients will give a reasonable Object Temperature result when evaluated near room temperature in most system designs. Once the system is stimulated, the default coefficients often return an obviously wrong Object Temperature.
A reference object temperature is needed for calibration. The TMP007EasyCalEVM includes a TMP112 Local Temperature Sensor for this purpose. The reference temperature sensor must make thermal contact with the object being measured by the TMP00x. Then, data collection can begin at a rate of one sample per second. The following information is required for each sample:
During logging, the system must be exercised to capture a temperature change. This can mean different things for different applications. Data should be collected and evaluated for the full temperature range expected in the application.
The data will be analyzed to select coefficients. These coefficients must then be programmed into TMP007, or used in the calculation performed by the host in the case of TMP006.
Collected data can be analyzed by the TMP007EasyCalEVM software even if a TMP006 is used or if the EVM hardware is not available. Data must be formatted as Comma Separated Values (CSV) text file with one sample per line break. Using the Analysis tab in the EasyCal software, choose Load Data File, and then Run Calibration to obtain coefficients on the right side of the screen. See the TMP007EasyCal User’s Guide (SBOU149) for more information.
Alternatively, see the TMP007 Calibration Guide (SBOU142) for information on manual methods of obtaining coefficients.
It is necessary to perform a one-time calibration of the system design in order to meet datasheet specifications. The accuracy can be improved beyond datasheet specifications by calibrating each system in production to remove device-to-device variations.
Since IR Temperature Sensors rely on Cold Junction Compensation, it is critical that the device does not experience radical temperature changes. The PCB Layout recommended by TI literature is intended to perform the following.
It is possible to reduce, redesign, or otherwise change the parameters of the recommended layout while maintaining good thermal performance. Other techniques, such as the use of a shield, offer greater advantages than layout alone. A system design which fully encapsulates the sensor with an external housing may not benefit from PCB layout techniques at all.
The construction of the TMP00x devices results in a thermopile that is closer to the PCB than it is to the top of the device. For this reason, radiated energy must travel through silicon substrate to reach the thermopile. The Through-Hole Layout is a new approach to PCB layout. A via is placed beneath the TMP00x device that directs energy through the PCB and directly onto the thermopile without passing through silicon substrate first. This layout offers a 2x improvement in signal, and allows the system designer a convenient way to control FOV. This layout requires that a cover or shield be placed over the device to block unwanted energy. For more information, see TMP006 and TMP007: Through-Hole Mounting Method (SBOA164.)
Our partner, Wurth Elektronik, has released their version of the metal shield to DigiKey. There are four variations available. The version without a hole, which is listed as solid on DigiKey, will block infrared energy from the top of the device, and is intended for use with the Through-Hole Layout. The other three versions, which are listed as vented on Digikey, are intended to reduce the Field-of-View in top view applications. The variations are as follows.
3690103020 – no hole
3690103021 – 0.99mm
3690103022 – 0.76mm
3690103023 – 0.51mm
The TMP00x devices are sensitive to medium wavelength infrared energy in the 4-16um range. Many materials that appear clear do not allow transmission of energy at this wavelength. A material that passes near wavelength infrared, such as the 940nm produced by an IR LED, may not be suitable for sensing temperature. Materials intended for infrared imaging are suitable. A low-cost material that we have evaluated is a kind of polypropylene sold by Edmund Optics.
Low Cost Window Material from Edmund Optics
Infrared Optics at Edmund Optics
Yes, the range and performance of TMP00x can be improved by a lens. Unfortunately, the cost of such lenses does not make sense for most customers. Please see offerings from Edmund Optics, ThorLabs, and others in the optics business.
Please see the following application report for information on WCSP devices like TMP007 and TMP006.
AN-1112 DSBGA Wafer Level Chip Scale Package
TMP007 Evaluation Module for Infrared Thermopile Sensor with Integrated Math Engine
TMP006 Evaluation Module
Sensor Hub BoosterPack
Educational BoosterPack MKII
Sensors BoosterPack Plug-In Module
SimpleLink™ Bluetooth low energy/Multi-standard SensorTag
TMP006 and TMP007 Layout and Assembly Guide
TMP007EasyCal User's Guide
TMP006 and TMP007: Through-Hole Mounting Method
TMP007 Calibration Guide
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