This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: AFE5816
To someone who may concern,
Hi, I am a PhD candidate in Nanyang Technological University, Singapore. Now we are trying to construct a portable medical system concluding sensors, AFE, wireless module and FPGA, applying to ultrasound healthcare. We use AFE5816 as the analog front end, however, we don't want to use the TSW1400 because it needs to connect to computer and use the GUI. which is not suitable for portable devices. We try to let the AFE5816 work without TSW1400 by applying the SPI signals(SCLK, SEN,SDATA) to the AFE5816 through Arduino. We have removed the R22 near U9 at the bottom of the board as the manual indicates, however, the SPI still could not be written into the AFE5816. Could I ask how to write SPI to AFE5816 or do you have any other suggestions to let the AFE5816 work without the use of TSW1400? Thank you very much!
Fang Zhongyuan, Phd Candidate, NTU, Singapore
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
In reply to Olu Sodipe:
In reply to ZhongYuan Fang:
You can solder two wires to R22's pads and have a grabber-to-grabber cable connecting both wires together. Once the AFE5816EVM is configured via the HMC-DAQ and is able to complete data captures, you can then disconnect the grabber-to-grabber and use the Arduino for SPI communications instead.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.