TMP117: Product specs: Expected operational life (hours) at specified temp range (-20C to 150C)

Hello Sigitas

The operational specification means that the datasheet parameters will hold at the rated temperature range (of --55C to +150C). There is nothing called an ideal operational life. There would be both external and internal factors that will have some effect on the device behavior. Now what type of behavior will the device exhibit, is hard to predict.

Is there a specific requirement for your application that you need the data on "ideal operational life". Please elaborate.

With some other TI products in the datasheet you can find Operating area graph, which shows Estimated life (hours) versus Continuous Tj temperature (C). Failure modes as Electromigration, Wirebond life, Packaging, etc.
I am willing to know how long these parts could continuously operate in recommended operating conditions as described in the datasheet.

Hello Sigitas

So what you are possibly looking for is the FIT rate. Is that correct, since I am not sure we have an expected life expectancy of the device for a failure spec'ed for the TMP117. Rather based on the operating requirements, we can provide a FIT rate.

Not sure if we are not confusing it with useful lifetime. In a simple words, I am designing a product that continuously runs at 135C ambient temperature and I want to be sure that TI part will have 0% failures for a certain amount of time, lets say 3 years.

Hello Sigitas

I believe it is characterized by the FIT rate which I can check. As a curiosity which other TI parts did you refer to for the same?

Other parts as:

http://www.ti.com/lit/ds/symlink/sm320f28335-ht.pdf

page 110,111

http://www.ti.com/lit/ds/symlink/opa2333-ht.pdf

page 8

http://www.ti.com/lit/ds/symlink/ads1278-ht.pdf

page 21

Hello Sigitas,

Thanks for the information. As I suspected, these are Hi-Rel parts (High Reliability) which need to have the information. On the other hand TMP117 is not a High Temp, High Reliability part and hence the information is not provided.

Secondly as per the datasheet section you mentioned, there is a point (3) in them which states the following

"The predicted operating lifetime vs. junction temperature is based on reliability modeling using electromigration as the dominant failure mechanism affecting device wearout for the specific device process and design characteristics."

This is nothing but the failure probability due to EMI. I can check for the same.