Part Number: CD4051B
My customer is considering to adopt CD4051BPWR and has a question.
I would be grateful if you could advise.
We'd like to CD4051PWR, but we have a concern about mount condition.
Because we will need to process preform bond heating and wave (flow) soldering.
Regarding flow solder, according to application note SNOA040B, it seems to be OK.
In this case, it needs to perform with bond heating and flow soldering.
Could you advise whether with bond heating and wave soldering is possible or not for CD4051BPWR ?
I'm happy to know the thermal limit of bond heating. (example it needs to be below Tjmax)
I appreciate your great help in advance.
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In reply to Adam Torma:
In reply to Shinichi1:
I have checked with our packaging team and they stated:
"PW is a TSSOP package.
TSSOP is developed and qualified for SMT process. Solder by reflow system.
This type of package can be mounted on PCB with wave soldering process.
But be aware that TI doesn’t provide any warranty for SMT packages
that was developed and qualified for reflow and customer use wave soldering
process to mount them on PCB. "
The quality and packaging information shows that the MSL/ PEAK Reflow rating to be 260 deg C per JDEC standard.
This application note also has more information on the reflow profiles.
Shinichi, This type of package can be mounted on PCB with wave(flow) soldering process, but be aware that TI doesn’t provide any warranty for customer use wave(flow) soldering process to mount them on PCB. Thank you, Adam
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