• Resolved

CD4051B: Bond heating and Flow soldering

Part Number: CD4051B

Dear Specialists,

My customer is considering to adopt CD4051BPWR and has a question.

I would be grateful if you could advise.

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We'd like to CD4051PWR, but we have a concern about mount condition.

Because we will need to process preform bond heating and wave (flow) soldering.

Regarding flow solder, according to application note SNOA040B, it seems to be OK.

In this case, it needs to perform with bond heating and flow soldering.

Could you advise whether with bond heating and wave soldering is possible or not for CD4051BPWR ?

I'm happy to know the thermal limit of bond heating. (example it needs to be below Tjmax)

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I appreciate your great help in advance.

Best regards,

Shinichi

  • Shinichi,

    I'm not familiar with soldering process for different packages. I will ask some people from our packaging team on different soldering methods for the PW package. I should have more information by the end of the week.

    Thank you,
    Adam
  • In reply to Adam Torma:

    Hi Adam,

    Thank you for your reply.

    In this case,
    As far as I see other threads, the TSSOP package seems to be able to withstand WAVE solder.
    I want you to comment whether there is no problem.

    Regarding the bond hardening profile slightly exceeds the absolute maximum rated storage temperature of the peak 150 ° C, and confirmation is necessary.
    If it is not acceptable, please let me know what degrees can be handled.

    I'm looking forward to waiting your reply.

    I appreciate your great help and cooperation.

    Best regards,
    Shinichi
  • In reply to Shinichi1:

    Shinichi,

    I have checked with our packaging team and they stated:

    "PW is a TSSOP package.

    TSSOP is developed and qualified for SMT process. Solder by reflow system.

    This type of package can be mounted on PCB with wave soldering process.

    But be aware that TI doesn’t provide any warranty for SMT packages

    that was developed and qualified for reflow and customer use wave soldering

    process to mount them on PCB. "

    The quality and packaging information shows that the MSL/ PEAK Reflow rating to be 260 deg C per JDEC standard. 

    This application note also has more information on the reflow profiles.

    Thank you,

    Adam

  • In reply to Adam Torma:

    Hi Adam,

    Thank you for your reply.

    The condition you mention is for reflow soldering.

    The customer'd like to confirm viability for wave (flow) soldering.

    Originally TSSOP(PW) package should be used Reflow soldering, but some cases it is required Wave(Flow) soldering.
    At this time, it correspond to that.

    Could you please comment about that.

    I appreciate your great help.

    Best regards,
    Shinichi
  • In reply to Shinichi1:

    Shinichi,

    This type of package can be mounted on PCB with wave(flow) soldering process, but be aware that TI doesn’t provide any warranty for customer use wave(flow) soldering process to mount them on PCB.

    Thank you,
    Adam

  • In reply to Adam Torma:

    HI Adam,

    Thank you for your reply.

    I understood your comment the same as my recognition.

    I appreciate your great help and cooperation.

    Best regards,
    Shinichi