This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: TS3A27518E-Q1
My customer considering TS3A27518E-Q1 for a new project.
Can we provide IBIS model for simulation purposes?
Can we determine the propagation delay time between COMx and NCx PINs?
Can we provide detailed info about MUX channel internal structure? (meaning: how the MUX is built on transistor level?)
•Can we provide IBIS model for simulation purposes?
Simulation models are found in the product folder on TI.com by clicking the tools and software tab
•Can we determine the propagation delay time between COMx and NCx PINs?
We don’t have the propagation delay specified in the datasheet. These types of devices are passive FET switches without any buffering so the propagation delays are very low <100s of ps range because it is only the time it takes a signal to travel from the drain to the source of the FET. Why is the propagation delay critical for this system?
•Can we provide detailed info about MUX channel internal structure? (meaning: how the MUX is built on transistor level?)
The TS3AXXXX devices are transmission gate switches with an NMOS FET in parallel with a PMOS FET. You can see this architecture in the ron vs input voltage graph in the datasheet. The resistance remains flat as the input voltage on the source approaches the Vcc (gate) voltage. If the device was only a NMOS FET the resistance would become increasingly high as the input voltage on the source approaches the gate voltage Vgs<Vt turning off the FET making the signal path Hi-Z. This application note explains more about the 3 different switch architectures and their advantages
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.