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  • TI Thinks Resolved

SN74CB3Q3253: The thermal information and power dissipation

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Replies: 1

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Part Number: SN74CB3Q3253

Hi Team,

Please help to confirm the thermal information of SN74CB3Q3253PWR. Data sheet doesn't show Θjc.

Also, how to calculate its power dissipation? Please kindly provide the formula.

Thanks

  • Daniel,

    Please se the thermal information below.

    RGY DBQ PW DGV
    Theta Ja Juntion-to-ambient thermal resistance 45.7 114.3 112.7 126
    Theta Jc(top) Junction-to-case (top) Thermal Resistance 59.6 65.4 47.5 51.3
    Theta JB Junction-to-board thermal resistance 23.3 56.8 57.8 57.8
    Psi JT Junction-to-top characterization parameter 2.2 18.3 6 5.9
    Pis JB Junction-to-board characterization parameter 23.4 56.4 57.3 57.3
    Jc(bottom) Junction-to-case (bottom) thermal resistance 11.5 N/A N/A N/A

    The formula and excel calculator can be found in the FAQ thread below.

    To help my understanding why do you need the thermal information and to calculate the power dissipation?  How is this information used in the system design?

    Thank you,

    Adam

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