Dear Specialists,
My customer is considering to adopt CD4051BPWR and has a question.
I would be grateful if you could advise.
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We'd like to CD4051PWR, but we have a concern about mount condition.
Because we will need to process preform bond heating and wave (flow) soldering.
Regarding flow solder, according to application note SNOA040B, it seems to be OK.
In this case, it needs to perform with bond heating and flow soldering.
Could you advise whether with bond heating and wave soldering is possible or not for CD4051BPWR ?
I'm happy to know the thermal limit of bond heating. (example it needs to be below Tjmax)
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I appreciate your great help in advance.
Best regards,
Shinichi