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SN74LVC1G3157: SMD or NSMD pads

Part Number: SN74LVC1G3157
Other Parts Discussed in Thread: TMUX1247

Dear *,

i see in the DS that recommended footprint for SN74LVC1G3157DTBR has solder mask defined pads.

Is there a problem if we use copper defined pads for this IC? 

Best Regards,

David.

  • Hi David, 

    Thank you for your question.

    Because this is a very small package with 6 pins, using Non Solder Mask Defined (NSMD, or copper defined pads) is not recommended. Using NSMD may result in inconsistent soldering pad dimension and cause the package to tilt.

    It is recommended to use Solder Mask Defined (SMD) pad to keep soldering pad dimension consistent.

    Have you seen the new device, TMUX1247? TMUX1247 has lower Ron, lower leakage current, and supports 1.8V logic levels and fail-safe logic.

    Best regards,
    Kate