Part Number: TS3A27518E
Hi TI engineers,
I got a question regarding signal (data I/O) propagation delay for QSPI application.
For my understanding the propagation delay from switch signal input to switch signal output (COM to NO or NC pins) should be small and is usually very insignificant because the closed switch act just like a resistor in terms of delay from signal input to output. Please correct me if I am wrong.
For my design the input- to output- delay of the multiplexer/switch (TS3A27518ERTWR) shall not introduce more than 100-150ps additional delay to the PCB path. Can TI guarantee a this?
Thanks in advance
You are correct.
The TS3A27518E is a passive FET switche and have almost no propagation delay due to the silicon die. The significant portion of the delay is due to the bond wire and packaging as seen in this e2e post below. Typically the packages these switches are in have single digit ns to ~100s ps propagation delay.
I found this post when searching the switches and multiplexers e2e forum about TS3A27518E propagation delay.
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
In reply to Saminah C:
thank you for reply.
Following the post/link there is table which shows a dependency on temperature.
This means at 25 (degree Celsius?) there is a 200ps propagation delay? Will propagation delay decrease when using BGA instead of WQFN package?
Thanks and regards
In reply to MaWü:
Yes, it is 25 Celsius.
The propagation delay will increase for BGA as it is laminate package with substrate routing in the package that makes the signal slower compared to WQFN.
Thank you Saminah,
that is interesting. How would be the delay for TSSOP package?
From package standpoint, TSSOP will have longer delay compared to QFN because of longer leads.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.