Part Number: TS3A227E
Please help me review TS3A227E schematic, especially MICP and MIC_PRESENT#,
As below information for your reference, thank you.
SCHEMATIC1 _ 0x_AUDIO CODEC_20180410A.pdf
Power pins: VDD is supplied with 3.3 V and is within the recommended operating conditions.
GND is correctly connected to the thermal pad and the unused GND sense line may also be connected to ground.
I2C SDA/SCL open drain outputs are pulled up to 3.3 V and are within the recommended operating conditions.
INT is an open drain interrupt and I couldn't find where it was going
MIC Present is also and open drain interrupt and it correctly attaches to a GPIO
DET Trigger is correctly connected to a switch in the combo audio jack that will pull the node to ground when a headset is inserted into the Jack
Tip/Ring2/Sleeve correctly connected to the audio jack
Sleeve Sense and Ring2 sense correctly connected to audio jack
MIP correctly connected to the codec.
Also please be aware of this post as well for Apple headsets.
In reply to Adam Torma:
In reply to Sam Liu69:
Thank you for your reply,
about MIC_PRESENT#, I will connect to "Sense A" pin of codec,
about INT#, I still confirm whether we need this pin,
ALC262 don't have "ground sense pin", so I couldn't connect to "GND_SENSE" of TS3A227E,
last, about C3(in the schematic is C111) that value can vary depending on codec needs,
could I change to 1K ohm?
SCHEMATIC1 _ 0x_AUDIO CODEC_20180412A.pdf
I only want to confirm C3 not R6, as below is request from codec vendor,
should I added C3(1uF) into below portion? thank you.
The TS3A227E does not require the C3 cap but was included in the datasheet to show in a typical application the codec will require a DC blocking cap. Please refer to the recommendation of the codec vendor for the capacitor you will not need an additional one for the TS3A227E.
As below is from recommendation of the codec vendor that don't use the capacitor(C3),
only added 1K, so if no C3, is it ok? thank you.
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