I’m using TI SN74CBTLV3257RGYR (VQFN package) in my design — I assume the thermal exposure pad is NC and can be connected to GND. It’s not specified in the datasheet.
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I’m using TI SN74CBTLV3257RGYR (VQFN package) in my design — I assume the thermal exposure pad is NC and can be connected to GND. It’s not specified in the datasheet.
Hello Jonas,
You'll be fine connecting it to ground. I need to check and see if it is actually a NC internally but it will take a few days. I'll respond back when I have the results.
Regards,
Andrew