Hi, may I know if RF430FRL152H is available in flip chip with gold bump format? If so, may I know what is the dimension of the flip chip and the size of the gold bump?
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Hi, may I know if RF430FRL152H is available in flip chip with gold bump format? If so, may I know what is the dimension of the flip chip and the size of the gold bump?
Hi Josh,
As I have a specific application which I intend to make it a passive NFC temperature sensor. In addition, I have a very tight space constraint. Currently I'm using a similar IC which I attach the antenna to the gold bump directly so I wonder if I can do the same for this part.
Hi Josh,
In fact, we outsource the antenna attaching part to another manufacturer. Do you mind to share more information about ACF, ACP and bond wires and then goop over?
Currently the temperature sensor will be attached with coil antenna measure at 3mm(diameter)x22mm(length). I have previously provide a bare DIE (with no bump) to the manufacturer but they have can't attached the antenna on to the bare DIE. I have subsequently provide another DIE with gold bump (110umx110um) then they can attach the antenna on it.
Hi Josh,
I have written an email to you two weeks ago, wonder if you have received it?
By the way, may I know how can I order the RF430FRL152H Flip Chip with gold bump from TI?
Thanks!