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RF430FRL152H Flip Chip Package

Other Parts Discussed in Thread: RF430FRL152H

Hi, may I know if RF430FRL152H is available in flip chip with gold bump format? If so, may I know what is the dimension of the flip chip and the size of the gold bump?

  • Howard -
    the RF430FRL15xH will be offered as probed wafer, too. Flip Chip really does not make sense here though as its not a simple tag IC like the TMS37112 or TMS37114. It (RF430FRL15xH) does have the need to be connected to external passives and does have analog and digital inputs, etc.

    make sense?
  • Hi Josh,

    As I have a specific application which I intend to make it a passive NFC temperature sensor. In addition, I have a very tight space constraint. Currently I'm using a similar IC which I attach the antenna to the gold bump directly so I wonder if I can do the same for this part.

  • the wafer can be processed, i see no issue with that, so you can put bumps on it as you desire - but i would think that bumps not serving any purpose, usually those are for if you would be using ACF or ACP to connect. in this case i think we would recommend bond wires and then goop over.
  • Hi Josh,

    In fact, we outsource the antenna attaching part to another manufacturer. Do you mind to share more information about ACF, ACP and bond wires and then goop over?

    Currently the temperature sensor will be attached with coil antenna measure at 3mm(diameter)x22mm(length). I have previously provide a bare DIE (with no bump) to the manufacturer but they have can't attached the antenna on to the bare DIE. I have subsequently provide another DIE with gold bump (110umx110um) then they can attach the antenna on it.

  • i only brought up ACF and ACP because this is what is best for flip chip, which you mentioned. please don't misunderstand here - bond wire attach is best way to connect to part and your silicon handler / packaging guy should be expert already at this.

    maybe its better you send me an email: josh.wyatt@ti.com to discuss your application
  • Hi Josh,

    I have written an email to you two weeks ago, wonder if you have received it?

    By the way, may I know how can I order the RF430FRL152H Flip Chip with gold bump from TI?

    Thanks!

  • Howard -
    just replied to your email and copied one of my colleagues, too