Other Parts Discussed in Thread: CC2420
Hello,
I've been using TI LPRF ICs since the CC2420, and am currently in the middle of a CC1310-7x7 layout. The QFN package is a pain for layout because the big thermal pad taking up the entire underside means that all the traces have to be routed outwards, away from the IC.
Suggestion: on the larger package sizes (7x7, 6x6, maybe 5x5) reduce the size of the thermal pad by approx. 0.3mm on each side so that we can place a 0.5mm diameter (20mil) via between the signal pin and the thermal pad, without messing up the thermal pad. I realize that I could put a via there now, but that would alter the thermal pad shape, which is undesirable.
