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WL1831MOD: WL1831MOD thermal performance

Shivasharan Nagalikar
Expert 6440 points
Part Number: WL1831MOD
Other Parts Discussed in Thread: TPS563209

Team,

One of my customers have following questions on WL1831MOD. 

1) In Our Layout Design, Layer of PCB is 10. We Place WL1831MOD in TOP Layer and Power supply of 1.5Volt/0.5 Amp generation using TPS563209 is placed under the Wi-Fi ic but in Bottom layer. So Can it Create any Problem in Thermal, Compliance and Performance of Module??

  2)In Our Layout Design, Layer of PCB is 8. We Place WL1831MOD in TOP Layer and Level Translator of WiFi is placed under the Wi-Fi IC but layer is Bottom. So Can it Create any Problem in Thermal, Compliance and Performance of Module?? 

 3)We are using Blind and Buried Via In BOTH Layout for for thermal pads of  WL1831MODGBMOCR . So Can It Create any thermal regarding issue OR any other issue?

Can you please suggest.

Best Regards,

Shiv

  • 0
    TI__Mastermind 35795 points
    Shiv, Are you able to share the layout design files and schematics for review ? If yes, you may email me the files .

    Thanks
    Saurabh
  • 0 in reply to S
    TI__Expert 6440 points

    Hi Saurabh,

    I have requested the design files. Will share via mail.

    Best Regards,

    Shiv

  • 0
    TI__Genius 12260 points
    Hi Shiv,

    As Saurabh stated we should probably review the design files. However a few comments below:

    1) and 2) Its best to try not to put any components under the module. as you need to have the thermal via relief under the part. There is a protection mechanism in the part that monitors the junction temperature and if it reaches 120C the power / modulation rate will be reduced thus protecting the part. Thus what you will see if there is a thermal issue is a reduction in thruput.

    3) As per our recommendations on the module you should have thru hole vias under the part to have a good thermal path. We would need to review the layout to see how this is and consider what the effects would be. Our recommendation is thru hole vias to remove the heat.

    Thanks Riz.