High-performance, low-cost evaluation boards for high-speed data converters

With the TSW1400EVM, TI is offering a high-performance, low-cost and complete solution for evaluating TI high-speed data converters. 

Up until now, you had to use different boards that were compatible with different interfaces to test our ADCs and DACs. We’re one of the first in the industry to combine that functionality to include testing for ADCs and DACs on either LVDS or CMOS interfaces. In addition, you can test up to 8 channels simultaneously with 16-bit samples utilizing up to 1GB of memory. This is the largest memory size available on the market and provides for higher resolution FFT and larger data frames for demodulation analysis.

Ready for more good news? All of this functionality can be yours for only $649 – a 75% price reduction over our previous generation. I think you’ll be hard pressed to find a better, more affordable way to evaluate high-speed data converters. 

Here’s a photo of the TSW1400EVM:  


 
TSW1405EVM and TSW1406EVM for simple eval
For those looking for an even lower-cost toolset solution, we have you covered with the TSW1405EVM and TSW1406EVM, which will be available next month.  Both boards are very small in size and will be offered at an 80% price reduction compared to anything else on the market.

The TSW1405EVM is our low-cost ADC capture board. It supports simple 16-bit waveform capture from most of TI’s LVDS-based high-speed ADCs. It features a 64k sample depth at I/O rates of up to 1.0 Gsps.  This simple evaluation tool, pictured below, measures 2.5”x3” and will be priced at only $99.

 

The TSW1406EVM allows for 16-bit pattern generation to most of TI’s LVDS-interface high-speed DACs. The board also comes with 64k pattern depth and supports up to 1.0 Gsps LVDS data rates. The TSW1406EVM, pictured below, measures 3”x3” and will also only cost $99.


 

The TSW1405EVM allows for testing devices with up to 8 channels concurrently, while the TSW1406EVM allows for testing up to 4 channels concurrently. Both are connected to the PC using a single mini-USB cable, which the boards use for power and also to transfer data.

If you are looking for a low-cost, simple test solution for high-speed data converters, look no further than the TSW1405 and TSW1406!

All new GUI
When we set out to design the graphical user interface for our new boards, we wanted a great out-of-the-box user experience. Our new GUI is compatible with the TSW1400EVM, TSW1405EVM and TSW1406EVM. It supports testing on both ADCs and DACs and is extremely easy to use. Here’s a snapshot of the new user interface:

 

When testing ADCs, you have the option to look at either the time or frequency domain. With a toolset capable of capturing 8 channels, the GUI allows for analysis of any 2 channels simultaneously. For DAC testing, the GUI comes integrated with a single- or multi-tone generator. You can also import predefined signals to run through your DAC.

Questions? 
If you have questions about our new high-speed data converter tools, I hope you’ll post them below or in our High-Speed Data Converter Forum. We’d love to hear from you!

Anonymous
Parents
  • Maybe there is a newer product than these:

    Page 13 in manual  SLWU082–May 2012 reads:

    "...Each bandwidth has two test models, TM1.1 and TM3.1. TM1.1 is used for

    ACPR measurements, whereas TM3.1 is used to test EVM performance when using the LTE signal. Using

    the TSW3085 EVM, the patterns can be loaded in complex format through the LVDS connection between

    TSW1400 and TSW3085EVM..."

    Confusing.

    Is this the "EVM performance" of the EVM or just the EVM of the of the EValuation Module?

    I would like to think EVM would mean Error Vector Magnitude. (Why not spell out Error Vector Magnitude as the acronym has already been used for your EValuation Board ;-)?)

    It is not clear in the TSW3085EVM manual SLAA509–December 2011, where the  Error Vector Magnitude results are presented.

    On page 9 of the above ".. All measurements for ACPR and EVM are taken at RF out, after the power amplifier, for the sake of a complete signal chain

    measurement..."

    I don't see this in the block diagram. I hoping I could include other parts in the signal measurement.

Comment
  • Maybe there is a newer product than these:

    Page 13 in manual  SLWU082–May 2012 reads:

    "...Each bandwidth has two test models, TM1.1 and TM3.1. TM1.1 is used for

    ACPR measurements, whereas TM3.1 is used to test EVM performance when using the LTE signal. Using

    the TSW3085 EVM, the patterns can be loaded in complex format through the LVDS connection between

    TSW1400 and TSW3085EVM..."

    Confusing.

    Is this the "EVM performance" of the EVM or just the EVM of the of the EValuation Module?

    I would like to think EVM would mean Error Vector Magnitude. (Why not spell out Error Vector Magnitude as the acronym has already been used for your EValuation Board ;-)?)

    It is not clear in the TSW3085EVM manual SLAA509–December 2011, where the  Error Vector Magnitude results are presented.

    On page 9 of the above ".. All measurements for ACPR and EVM are taken at RF out, after the power amplifier, for the sake of a complete signal chain

    measurement..."

    I don't see this in the block diagram. I hoping I could include other parts in the signal measurement.

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