Reviewing this year’s program of events for APEC in Tampa, Florida, on March 26-30 provoked a few nostalgic memories. Back in 1994, I attended my first APEC conference at Disney World in Orlando, Florida, and was impressed to see so many power electronics experts at one event. I actually had the pleasure to meet Ned Mohan, the author of my undergraduate power electronics textbook. Unfortunately, I hadn’t brought it along for an autograph.
That event, as in the previous years, had many papers and speakers discussing the latest innovations in power-supply design, including soft switching inverters, which helped me with my graduate research. To interact with the authors of the papers I studied and to listen to their presentations was a learning experience that I will never forget.
I also enjoyed the product demonstrations and discussions with other engineers at the exhibitor booths. In graduate school, I had only read about the specifications of “hockey puck” diodes and insulated gate bipolar transistor (IGBT) half bridges. Seeing the products and asking questions was also very beneficial for my research project.
From educational seminars to live in-booth demos, APEC’s tradition of expanding your knowledge of power electronics continues at this year’s show. Stop by TI’s booth, No. 701, to get your questions answered by TI experts; meet Bob Mammano and enter for a chance to win a copy of his new book, “Fundamentals of Power Supply Design” (Figure 1); get to see our newest products; and witness the unveiling of end-to-end power-management system solutions including hardware, software and reference designs that help you get to market quickly.
Figure 1: Bob Mammano’s book, “Fundamentals of Power Supply Design”
If you are a returning attendee or this is your first time at the show, I hope you enjoy the conference as much as I have. Perhaps Bob Mammano will agree to autograph a couple of Power Supply Design Seminar books that I cherish – if I remember to bring them along.
What you’ll find in TI’s booth
At APEC, TI will give designers the power to:
Figure 2: High current PMBus power module with telemetry for communication applications
Figure 3: TI-PMLK buck-boost board
Stay connected with TI at APEC 2017: see ti.com/apec2017 and follow us on Twitter and Facebook. Tune into Facebook Live discussions throughout APEC to watch demonstrations, hear more about TI’s latest news in power innovation, and get your questions answered by TI experts in real time.
Find out more about TI’s power-management portfolio
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