TI grabs 14 spots on EDN Hot 100 Products of 2011 list.

Other Parts Discussed in Post: LM5113, TINA-TI

Each year, the later months on the calendar bring an influx of awards and acknowledgement from the media about which parts were the "best" or "most innovative" or "most influential." EDN prefers to take a different route and simply give us the Hot 100 of 2011. These are the products that don't need any extra superlatives around them, because they speak for themselves. Last year, we had eight products on that Hot 100 list, and this year, we're proud to announce that 14 of our products made the cut, more than any other company.

Specifically, TI's power team garnered three inclusions.
  • bq77910 -The industry's first fully integrated battery protection and cell-balancing solution for Li-Ion and lithium iron phosphate battery packs. The device can manage 4- to 10-cell battery packs, and two devices can be stacked to protect 11- to 20-cell packs.

  • LM5113 - The industry's first 100-V half-bridge gate driver optimized for use with enhancement-mode GaN FETs in high-voltage power converters. The LM5113 is a highly-integrated, high-side and low-side GaN FET driver that reduces component count by 75 percent and shrinks printed circuit board (PCB) area by up to 85 percent compared to discrete driver designs.

  • LM3448 and TPS92070 -  Highly integrated, phase-dimmable AC/DC LED lighting drivers for use in solid state lighting residential, architectural, commercial and industrial applications, such as retrofit bulbs, LED ballasts, downlights, spot lights and other luminaires.

 

On the signal chain side of the equation, we had six devices selected.

  • OPA2188 - The industry's first zero-drift, 36-V operational amplifier (op amp). 

  • ADC12Dxx00RF family - Industry's first analog-to-digital converters (ADCs) to directly sample RF signals beyond 2.7-GHz. 

  • ADS5263 - The first quad-channel, 16-bit ADC for medical imaging applications, such as magnetic resonance imaging (MRI).

  • TMP006 - The industry's first monolithic passive infrared (IR) MEMS temperature sensor, enabling contactless temperature measurements in a solution that is an astounding 95% smaller than competitors.

  • DRV8662 - The most highly integrated piezo haptic driver for mobile consumer and industrial designs, with a solution size that is 50 percent smaller than leading competitors.

  • Tina-TI 9.1 - A major update to the popular TINA-TI SPICE-based design tool, version 9.1 includes 565 TI models, as well as a 5X speed increase over version 7.0.

Three of our microcontroller (MCU) solutions were featured on the list as well.


  • LM4FX family - The first Cortex-M-based MCUs to be built on 65 nanometer (nm) technology, with floating point for performance headroom and best-in-class power consumption to address portability and power budgets.

  • MSP430AFE2xx - The industry's first programmable single-phase metrology devices supported with multiple communication interfaces.

Finally, our low power RF team had two devices chosen.

  • CC1180 and CC430 - Sub 1-GHz 6LoWPAN solutions, aimed at providing a gateway for remote, low-cost wireless sensors to connect to the Internet and a wireless extension of wired IPv6 infrastructures. TI's 6LoWPAN solutions offer longer wireless range at lower power levels than traditional 2.4-GHz-based 6LoWPAN offerings.

  • CC112x - The industry's highest performance narrowband RF transceiver, with range significantly beyond 10 km (137-dB link budget) and more than 60-dB adjacent channel rejection (20-dB more than nearest competition).

Are you using any of our products that you think should have made the cut as well? Let us know!

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