Reporting Options

# File in Previous Format

Date | : | 7/6/2021
Time | : | 8:13:51 AM
Filename | : | \\ent.ti.com\data\HSP_DC\Users.fdr\Dan_B\RF Power detectors\LMV225_archive\LMV225_228 LLP6 Eval Board\LMV225_228 LLP6 Eval Board\LMV225_228 LLP6 Eval Board.PcbDoc

Version | Warning
--- | ---
Summer 09 | CAUTION - File contains old violation objects. These violations are no longer supported & will not be loaded. Please run DRC after opening this file in order to refresh the violations.
Summer 09 | CAUTION - Existing testpoint rules and settings are used as fabrication testpoint information.
Release 12 | CAUTION - Air Gap Width previously controlled by Clearance rule is now controlled by Polygon Connect Style rule's newly introduced Air Gap Width (set to default value). Suggest reviewing each Polygon Connect Style rule's Air Gap Width attribute for correctness.
Release 13 | CAUTION - Silkscreen Over Component Pads Rules are converted to Silk To Solder Mask Clearance Rules. Suggest examining rule scopes for accuracy.

This file was generated by an earlier version of the software