COPYRIGHT (C) 2022 TESSOLVE SEMICONDUCTOR PVT. LTD., ALL RIGHTS RESERVED
THE INFORMATION CONTAINED HEREIN IS THE EXCLUSIVE PROPERTY OF TESSOLVE SEMICONDUCTOR PVT. LTD.
AND SHALL NOT BE DISTRIBUTED AND SHALL NOT REPRODUCED OR DISCLOSED IN WHOLE OR IN PART WITHOUT 
PRIOR WRITTEN PERMISSION OF TESSOLVE SEMICONDUCTOR PVT. LTD.
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CUSTOMER		-	TI          	
CARD NAME		-	309167-9165-D
PART NUMBER		-	-	    	
DATE                  	-       16-Feb-2022
DESIGNED AT     	-       Tessolve Semiconductor Pvt. Ltd.
CONTACT E-Mail ID	-       engineering_cbe@tessolve.com
GERBER FORMAT 		-       RS274X , ENGLISH  2,5 LEADING
DRILL FORMAT 		-	EXCELLON ENGLISH  2,5 TRAILING
PACKAGE NAME   		-	9165-D_TLV3602EVM_FAB.zip

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LIST OF FILES INSIDE PACKAGE:

ELECTRICAL LAYERS :

AMPS155A.GTL		        - Layer 1 (Top Layer)
AMPS155A.G1		        - Layer 2 (GND 1)
AMPS155A.G2		        - Layer 3 (Power)
AMPS155A.GBL		        - Layer 4 (Bottom Layer)

NON ELECTRICAL LAYERS :

AMPS155A.GTS		  - Solder Mask Top Side 
AMPS155A.GBS		  - Solder Mask Bottom Side 
AMPS155A.GTO		  - Silkscreen Top Side
AMPS155A.GTP		  - Solder Paste Top Side
AMPS155A.GBP		  - Solder Paste Bottom Side
AMPS155A.GD1		  - Fabrication Drawing
AMPS155A.GM1              - Board outline file

DRILL LAYERS :

AMPS155A-Plated.TXT      -  Plated through holes drill file 

    
OTHER FILES :

AMPS155A_IPC-D-356A Netlist.ipc     - IPC-D-356A Netlist 
AMPS155A_FabNotes.PDF		    - PDF of Fabrication Drawing
Readme_Fab.txt		            - This files





