| Version |
Warning |
| 6.3 |
CAUTION - Via connections to both hatched and solid signal layer polygons are now controlled by the polygon connect style rule. Re-pouring polygons may result in physical copper differences. |
| Summer 09 |
CAUTION - File contains old violation objects. These violations are no longer supported & will not be loaded. Please run DRC after opening this file in order to refresh the violations. |
| Summer 09 |
CAUTION - Existing testpoint rules and settings are used as fabrication testpoint information. |
| Release 12 |
CAUTION - Air Gap Width previously controlled by Clearance rule is now controlled by Polygon Connect Style rule's newly introduced Air Gap Width (set to default value). Suggest reviewing each Polygon Connect Style rule's Air Gap Width attribute for correctness. |
| Release 13 |
CAUTION - Silkscreen Over Component Pads Rules are converted to Silk To Solder Mask Clearance Rules. Suggest examining rule scopes for accuracy. |