### Bump component lead

Solder bump acts as a connection between a chip or a pin and the board. A solder bump forms both the electrical and mechanical connections between a package and a die. The soldering is done by electroplating a conductive material on the wafer pads. The soldering can be done manually or by using automated equipment. Solders can be placed using photolithography: thin film deposition and plating techniques to place solder on a chip or pin lead pads. If the system is designed as per well-known models, failures can be detected from within the solder.

You can eliminate the cost of applying solder to the PCB for flip chips by using fully reflowable balls that allow all the solder to be placed on the component. For fully reflowed balls, solder becomes self-centered and collapsed, making the assembly process easier and error free. When solder melts during reflow process, the joints form a relatively spherical shape. However, the exact dimension, both diameter and height, of the shape may change a bit.