### Wire To Finger Spacing

This rule applies only to the space between a bond wire and finger, and does not apply to die-to-die bond wires.
The distance is measured as the minimum 2D separation between the wire and finger's conductor pad edge, ignoring any finger pads on BONDING WIRE, DIELECTRIC, or SOLDERMASK layers.
To run this online rule, choose Setup - Constraints - Modes and set Wire to Bond Finger to On.

#### DRC Code: %2