Same Net Bond Finger Spacing

 This group consists of Same Net Bond Pad Spacing constraints.
 The rules are as follows:

• Bond Pad to Line: Defines the minimum same net bond finger to line spacing.
  
  
• Bond Pad to Thru Pin: Defines the minimum same net bond finger to thru pin spacing.
  
  
• Bond Pad to SMD Pin: Defines the minimum same net bond finger to SMD pin spacing.
  
  
• Bond Pad to Test Pin: Defines the minimum same net bond finger to test pin spacing.
  
  
• Bond Pad to Thru Via: Defines the minimum same net bond finger to thru via spacing.
  
  
• Bond Pad to BB Via: Defines the minimum same net bond finger to blind/buried via spacing.
  
  
• Bond Pad to Test Via: Defines the minimum same net bond finger to test via spacing.
  
  
• Bond Pad to Microvia : Defines the minimum same net bond finger to microvia spacing.
  
  
• Bond Pad to Shape: Defines the minimum same net bond finger to shape spacing.
  
  
• Bond Pad to Bond Finger : Defines the minimum same net bond finger to bond finger spacing.