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Design Rule Verification Report

Date : 2017/7/25
Time : 16:18:09
Elapsed Time : 00:00:03
Filename : C:\Users\Percy\Desktop\PCB工程\ETC\ETC项目24V板-V6.1\24V ETC CONTORLLE V6.1.PcbDoc
Warnings : 0
Rule Violations : 14

Summary

Warnings Count
Total 0

Rule Violations Count
Short-Circuit Constraint (Allowed=No) (All),(All) 1
Un-Routed Net Constraint ( (All) ) 0
Clearance Constraint (Gap=7mil) (All),(All) 6
Power Plane Connect Rule(Relief Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Width Constraint (Min=10mil) (Max=50mil) (Preferred=10mil) (All) 0
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All) 0
Hole Size Constraint (Min=1mil) (Max=100mil) (All) 0
Hole To Hole Clearance (Gap=1mil) (All),(All) 0
Minimum Solder Mask Sliver (Gap=1mil) (All),(All) 7
Silk To Solder Mask (Clearance=0mil) (IsPad),(All) 0
Silk to Silk (Clearance=0mil) (All),(All) 0
Net Antennae (Tolerance=1mil) (All) 0
Total 14

Short-Circuit Constraint (Allowed=No) (All),(All)
Track (134.953mil,770.268mil)(135.732mil,769.488mil) Bottom Layer Pad U3-3(135.732mil,769.488mil) Bottom Layer
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Clearance Constraint (Gap=7mil) (All),(All)
Track (-349.897mil,577.898mil)(-316.898mil,577.898mil) Top Layer Pad U4-16(-316.898mil,621.205mil) Top Layer
Track (-316.898mil,577.898mil)(-257.843mil,518.842mil) Top Layer Pad U4-16(-316.898mil,621.205mil) Top Layer
Track (-179.102mil,440.102mil)(-151.543mil,440.102mil) Top Layer Pad U4-32(-179.103mil,396.795mil) Top Layer
Track (-248mil,509mil)(-179.102mil,440.102mil) Top Layer Pad U4-32(-179.103mil,396.795mil) Top Layer
Pad C17-2(-358mil,-361mil) Top Layer Pad C16-2(-358mil,-407mil) Top Layer
Via (-426mil,545mil) Top Layer to Bottom Layer Via (-426mil,576mil) Top Layer to Bottom Layer
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Minimum Solder Mask Sliver (Gap=1mil) (All),(All)
Via (148mil,595mil) Top Layer to Bottom Layer Pad R24-1(146mil,562mil) Top Layer
Via (-451mil,-357mil) Top Layer to Bottom Layer Pad C17-1(-418mil,-361mil) Top Layer
Via (40mil,-268mil) Top Layer to Bottom Layer Pad T2-5(-65.098mil,-290.528mil) Top Layer
Via (40mil,-315mil) Top Layer to Bottom Layer Pad T2-5(-65.098mil,-290.528mil) Top Layer
Via (35mil,-657mil) Top Layer to Bottom Layer Pad T1-5(-65.098mil,-602.528mil) Top Layer
Via (39mil,-421mil) Top Layer to Bottom Layer Pad T2-6(-66.705mil,-397.315mil) Bottom Layer
Via (39mil,-580mil) Top Layer to Bottom Layer Pad T1-5(-66.705mil,-602.425mil) Bottom Layer
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