LAUNCHXL-CC26X2R1: Why can't Persistent_app projects access locations after 0x34000?

Hello Ryan,

Ryan Brown1 said:

You will need to modify the SysConfig NVS module and command linker files (.cmd) of both the persistent and main applications, and possible the bim_onchip as well, to change the memory allocations.

How should we modify of what you said above? 

Part Number: LAUNCHXL-CC26X2R1

My request: User application partition is 0-0x28000(160k), persistent0x28000 -0x50000(160K), bim_onchip(8k), Ccfg+NV (24k), Total 352k
And the user application can read and write persistent and ccfg+NV(24k) partitions
Persistent can read and write the user application and ccfg+NV(24k) partitions
The bim_onchip can read and write the user application and ccfg+NV(24k) partitions
How do I modify it?
Test yourself as follows
Engineering: Persistent

erro；

makefile:184: recipe for target 'persistent app_CC26X2R1_LAUNCHXL_tirtos7_ticlang.out' failed
error #10324-D: BOUND section ".TI.bound:flashBuf0" spans the boundary of an existing memory range FLASH_IMG_HDR
error #10099-D: program will not fit into available memory, or the section contains a call site that requires a trampoline that can't be generated for this section. run placement with alignment fails for section ".TI.bound:flashBuf0" size 0x28000
error #10010: errors encountered during linking; "persistent app_CC26X2R1_LAUNCHXL_tirtos7_ticlang.out" not built

simple_peripheral_oad_onchip：

The CMD for persistent and simple_peripheral_oad_onchip is modified as follows: 

However, persistent flushes the 0-0x28000 address of simple_peripheral_oad_onchip with an error. 

I've already shared the NVS module location within SysConfig, and the command linker files are located at <sdk_source>/examples/rtos/LP_CC2652R7/ble5stack/<project_name>/tirtos7/ticlang/cc13x2x7_cc26x2x7_app_tirtos7.cmd as expressed in the Project Properties -> CCS Build -> Arm Linker -> File Search Path.  Specific changes are dependent on your application needs, which have not been made clear given I've already stated that NVS alterations are expected from the BLE application project and not from the persistent application.

Regards,
Ryan

thank you，I'm sorry I don't understand why I posted to the e2e forum under this post. 

Alex Zhang said:

Part Number: LAUNCHXL-CC26X2R1

My request: User application partition is 0-0x28000(160k), persistent0x28000 -0x50000(160K), bim_onchip(8k), Ccfg+NV (24k), Total 352k
And the user application can read and write persistent and ccfg+NV(24k) partitions

Regards,
Alex

I merged the threads since they were so similar.  I provided a valid and adequate solution configuration given the expected memory layout for OAD projects.  Any further application changes must be accomplished by the developer.

Regards,
Ryan

Thank you I get it ，The customer has now updated his response to the question ：

I hope that both B and A can use NVS_write to flash the other side, A, B and BIM can read and write SNV 

”IMG_A_FLASH_START: 0x2E000“ 

This modification, the app still cannot flush persistent projects

Partition B (app)

Partition A (persistent) 

Regards,
Alex

Although not the intent of the original design, it is certainly possible for multiple concurrent applications to access SNV.  Please note that the BIM is not designed for TI Driver usage and will have to increase its memory space for NVS functions, furthermore the applications will have to coordinate opening and closing the NVS TI Driver to properly transfer control during runtime.  They should make sure this function is absolutely necessary before attempting to incorporate it.

Alex Zhang said:

This modification, the app still cannot flush persistent projects

This will need to be further described with more details.

Regards,
Ryan