Part Number: BQ27Z558 Other Parts Discussed in Thread: SHA-256 , Tool/software: BQ27Z558 support SHA-256 authentication which should contain a 64 bit authentication key , but we found that item 12.8.20 in the TRM define the key as 32 bit, please let me…
Part Number: BQ27Z558 Other Parts Discussed in Thread: BQ27427 , , BQSTUDIO
Tool/software:
Dear TI Support,
We have migrated from the BQ27427 to the BQ27Z558 and are encountering some challenges with the setup and configuration.
Previously, with the BQ27427…
Part Number: BQ27Z558 Other Parts Discussed in Thread: GPCRB Tool/software: We are working on a project that uses the TI BQ27Z558YPHR DSBGA12 HF IC. During the low - temperature RBTweek test, the GPC report showed a Qmax is only 99mAh. This result was…
Part Number: BQ27Z558 Tool/software: Dear TI experts,
My customer considers BQ27Z558 for their next project, and they have few question.
1. My customer wants to proceed learing cycle in 0 degree ambient temperature because actual environment is about…
Part Number: BQ27Z558 Tool/software: Hi support team,
Is the BQ27Z558 a device that is installed inside the battery pack and not on the system board?
Also, does the BQ27Z558 support LiFePO4 battery?
Regards, Dice-K
Part Number: BQ27Z558 Other Parts Discussed in Thread: BQ27Z746 Tool/software: Dear TI Support Team,
I am looking for a battery gauge IC for a 1S battery pack that meets the following customer requirements:
Capacity Calculation : The gauge IC should provide…
Part Number: BQ27Z558 Tool/software: Can I get the .bqz file for 1558_0_01 ie BQ27Z558?
https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1385981/bq27z558-urgent-bq27z558-bqstudio-support-for-new-part
It was…
Hello,
Ben Farrimond said: BF: The parameters would be Ambient Temperature, Humidity etc, essentially for a golden image that is reliable and to increase the accuracy of state of health, are the conditions the battery are in important when generating this…
Part Number: BQ27Z558 Tool/software: Hello expert,
We are in need of information on the UBM (Under Ball Metallization)/SRO (Solder Resist Opening) of this device BQ27Z558.
We need this for our DFM team to define their own land pattern.
Thank you,
…