Answered

• CD74AC238: CD74AC238

  

  Lovely Javier

  Resolved

  Part Number: CD74AC238 Tool/software: Hello, We are creating Physical Footprint for part number CD74AC238BQBR which has BQB package. I looked into "Find TI Packages" https://www.ti.com/packaging/docs/searchtipackages.tsp?packageName=QFN And was…

  • Resolved

  • over 1 year ago
  • Logic
  • Logic forum
Answered

• CD74AC238: Is grounding the thermal pad of CD74AC238BQBR acceptable?

  

  Mark Goncharovsky

  Resolved

  Part Number: CD74AC238 Tool/software: Is it acceptable to connect the thermal pad of CD74AC238BQBR to circuit ground. (The datasheet only said - "The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical…

  • Resolved

  • over 1 year ago
  • Logic
  • Logic forum

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