Part Number: CSD19537Q3
Could you please let me know the pad flatness (i.e. maximum pad to board distance) information of CSD19537Q3?
Is it same as A1 (max. 0.05mm) in the datasheet package information?
My customer assumes it should be larger…
Part Number: CSD19537Q3 Other Parts Discussed in Thread: CSD19538Q2 Hi Team,
My customer is considering CSD19537Q3 for 1A output current in Digital Output Module. In the datasheet, to achieve required thermal performance (Rtheta JA = 55 deg C/W), the…
Part Number: CSD19537Q3 Device containing ~2% lead.
Datasheet: RoHS compliant.
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Can you support…
Part Number: CSD19537Q3 Hello. I have a question regarding the parameter of thermal resistance of Junction to case, specified at 1.5°C/W.
The notes state:
RθJC is determined with the device mounted on a 1-in2 (6.45-cm2 ), 2-oz (0.071-mm) thick Cu…
Part Number: CSD19537Q3 Other Parts Discussed in Thread: CSD19538Q2 , CSD19538Q3A Hi,
Could you please help us with the following question,
I have a question about the following N-MOSFETs - CSD19537Q3 - CSD19538Q2 - CSD19538Q3A Do these types have an integrated…