Answered

• CSD19537Q3: Overload capacity

  

  Allen Lu

  Resolved

  Part Number: CSD19537Q3 Other Parts Discussed in Thread: CSD19532Q5B , CSD19533Q5A hi TEAM, Customer have a 48VIN, 9A bus current BLDC driver aim to use CSD19537Q3 for higher power density . checking the datesheet, there is a new spec with 9.7A with…

  • Resolved

  • 3 months ago
  • Power management
  • Power management forum

• CSD19537Q3: CSD19537Q3

  

  Lital Rouch

  TI Thinks Resolved

  Part Number: CSD19537Q3 Tool/software: hello, We are using the following component CSD19537Q3 MOSFET N-CH 100V 50A 8VSON for new development. Is there any known stock risk/Not recommended for use/obsolete for this component? thanks, Lital

  • over 1 year ago
  • Power management
  • Power management forum
Answered

• CSD19537Q3: Spice Model Inquiries

  

  Jun Sheng Ow

  Resolved

  Part Number: CSD19537Q3 Other Parts Discussed in Thread: TINA-TI Tool/software: Hi E2E Elites, I'm currently using the spice model downloaded from TI website and created a symbol inside LTSpice. Based on the datasheet it says, Vgs needed typical…

  • Resolved

  • over 1 year ago
  • Power management
  • Power management forum
Answered

• PSPICE-FOR-TI: CSD19537Q3 model not in library

  

  Jan Bock

  Resolved

  Part Number: PSPICE-FOR-TI Tool/software: Hello Team, CSD19537Q3 this model is not in the library - can you please add it. Thanks Jan

  • Resolved

  • over 2 years ago
  • Simulation, hardware & system design tools
  • Simulation, hardware & system design tools forum

• CSD19537Q3: Thermal data required

  

  Lathish kumar

  TI Thinks Resolved

  Part Number: CSD19537Q3 Other Parts Discussed in Thread: CSD87351ZQ5D , Hi Team, We are using CSD87351ZQ5D and CSD19537Q3 FET in one of our designs where we need Junction-to-Board( θJB) thermal data.

  • over 2 years ago
  • Power management
  • Power management forum
Answered

• CSD19537Q3: Pad flatness information

  

  Kazuki Itoh

  Resolved

  Part Number: CSD19537Q3 Hi team, Could you please let me know the pad flatness (i.e. maximum pad to board distance) information of CSD19537Q3? Is it same as A1 (max. 0.05mm) in the datasheet package information? My customer assumes it should be…

  • Resolved

  • over 3 years ago
  • Power management
  • Power management forum
Answered

• CSD19537Q3: protection diode between G-S

  

  Dice-K

  Resolved

  Part Number: CSD19537Q3 Hi support team, Is there a protection diode between G-S? Regards, Dice-K

  • Resolved

  • over 3 years ago
  • Power management
  • Power management forum

• CSD19537Q3: CSD19537Q3 Thermal

  

  Shinu.V.Mathew

  TI Thinks Resolved

  Part Number: CSD19537Q3 Other Parts Discussed in Thread: CSD19538Q2 , CSD17581Q5A Hi Team, My customer is considering CSD19537Q3 for 1A output current in Digital Output Module. In the datasheet, to achieve required thermal performance (Rtheta JA = 55…

  • over 6 years ago
  • Power management
  • Power management forum
Answered

• CSD19537Q3: Is the Junction-to-case thermal resistance measured at the top of the case or at the bottom?

  

  Kurt Schmidt

  Resolved

  Part Number: CSD19537Q3 Is R_thetaJC in 5.2 measured at the case top or case bottom (i.e., thermal pad) Thank you in advance, Kurt

  • Resolved

  • over 2 years ago
  • Power management
  • Power management forum

• CSD19537Q3: CSD19537Q3:

  

  Veena Ramaiah

  TI Thinks Resolved

  Part Number: CSD19537Q3 Please confirm if "CSD19537Q3" is qualified for Automotive grade? Can this part be used for inverter section to drive BLDC motor in Automotive graded

  • over 7 years ago
  • Power management
  • Power management forum

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