Part Number: LM117HVQML-SP Hello
My question is regarding the die version of the part: LM117H MDE (not for the packaged part)
Can you please advise what is the max. current at Tj=105C
At the following setup:
Vin = 10.3V, Vout = 8V
and please specify…
Part Number: LM117HVQML-SP Other Parts Discussed in Thread: LM117HV , Hi,
I'd like to have references regarding the flight heritage of the component in object (flight hours, missions, missions profiles etc.).
Thanks in advance,
EF
Other Parts Discussed in Thread: LM117HVQML-SP , LM117HV Hi~
Our customer checking about LM117HVQML-SP device.
If see datasheet, it mentioned 5962# Part number.
What is different that 5962R0722901VXA, 5962R0722902VXA, 5962R0722961VXA ??
Please reply as soon…
Part Number: LM117HVQML-SP
Hi, I am trying to understand the Delta and Post Radiation Data, in particular for Vref, for worst case tolerances of the output voltage.
The orderable device that we will be using is 5962R0722962VZA.
For the post radiation,…
Other Parts Discussed in Thread: MKT-WG16A-MS , MKT-WG10A-MS , SN0020HKH , SN0010HKU , SN00020FK Looking for mechanical package samples for trim and form setup
Answer:
For our Power Ceramic QMLV qualified portfolio of devices we do offer the following mechanical…
Hi Tilman,
Welcome to E2E Design Support Community!
We are actually working on updating our TI Space Products Guide (ti.com/spaceguide) to include a list of Dummy Packages / Mechanical Samples, which should be updated in the coming months. In the meantime…
{ANS} For a number of our most popular QML Class-V radiation-hardened ceramic packaged devices (denoted with the -SP at the end of the part number) TI does offer engineering model ”/EM” versions and if these /EM parts are available you can find these…
Lead-times and available finished good inventory vary by device and change over time, but we are dedicated to providing quick and easy access to all our devices via TI.com.
To help provide more transparency into TI’s available inventory, in late 2020…
Could TI please provide guidance for how to trim/form the leads of ceramic devices and provide the PCB footprints so we can integrate into our system design?