Part Number: LMG3410-HB-EVM Does TI have any application notes for GaN devices?
Does TI have any papers that explain why GaN devices from TI are not at risk of hydrogen poisoning?
Does TI have any papers explaining why on orbit atmospheric H2 or H 2 will…
Part Number: LMG3410-HB-EVM Other Parts Discussed in Thread: UCD3138 , ISO7831
Hi Team,
Customers are using the LMG3410-HB-EVM for testing at LLC on several of their products.
Currently, the two SN6505 on the EVM are removed, and the 3.3V on the secondary…
Part Number: LMG3410-HB-EVM Dear TIer,
I have assembly question about LMG341xEVM. May I know the TIM is direct paste between on Exposed copper pads and heatsink? 1. There is no need solder reflow assemble? 2. there has problem about shock cause heatsink…
Part Number: LMG3410-HB-EVM Other Parts Discussed in Thread: LMG34XX-BB-EVM , , LMG3411R050 Hello, I have set up my power board to use the above half-bridge demonstration board for a PhD project. When I apply a 5V power supply to the demo board, the LED…
Part Number: LMG3410-HB-EVM Other Parts Discussed in Thread: LMG34XX-BB-EVM Dears, We need to know what is the minimum Voltage required for "LMG3410-HB-EVM" daughter card to function properly we couldn't find any related information about the…
Part Number: LMG3410-HB-EVM Hi,
There are pictures of the measurement scene in the User's Guide.
https://www.tij.co.jp/jp/lit/ug/snou165a/snou165a.pdf?ts=1634711031057&ref_url=https%253A%252F%252Fwww.tij.co.jp%252Ftool%252Fjp%252FLMG3410EVM-018…
Part Number: UCD3138 Other Parts Discussed in Thread: PMP20873 , PMP22220 , LMG3410-HB-EVM , , UCC28600 , UCD9240 , UC3854 Tool/software: If I want to design a PFC with a bridgeless totem pole, does UCD3138 integrate the above algorithm internally? If not…
Part Number: LMG3410-HB-EVM Hi, When I have received my PCB from manufacture, the PCB footprint for the half bridge GaN demonstration board is not correct. Or at least, the one I created, is not correct. I have attached some images to support this question…
Part Number: LMG3410-HB-EVM Looking for the supplier that provides the Thermal Interface Material for the heatsink on this design. The Material is from Bergquist/Henkel and is described as "TI-Bond Ply100 0.005"/.127mm(1).cu-27.0mm by 27.0mm".…
Hi Tom,
For the GaN daughtercard please refer to the LMG3410-HB-EVM . The design files, including schematic, are available at that link.
Best,
Kyle Wolf