Part Number: LMG3522R030 Other Parts Discussed in Thread: LM5156 , Team,
Customer would like to implement a BOOST with LMG35xxx drieven by an analog controller.
Assuming that LM5156 would be used as controller what driver circuit would you recommend between…
Part Number: LMG3522R030 Hello,
Table 6.3 in the datasheet specifies the recommended inductance for Lbbsw.
is there a specific inductor that TI recommends, or any 4.7 uH (with > 1 A current rating) should work?
For example, this one: https://www.digikey…
Part Number: LMG3522R030-Q1 Other Parts Discussed in Thread: LMG3522EVM-042 Hello,
in datasheet it is mentioned on page 3.: "Used to anchor QFN package to PCB. Pins must be soldered to PCB landing pads. The PCB landing pads are non-solder mask defined…
Part Number: LMG3522R030 Hi Everyone,
I have downloaded the PLECS simulation model of the LMG3522R030 device and thereby I obtained remarkably low temperature rise of the GaN FET.
For test purpose, I checked the behaviour with a simple Buck configuration…
Part Number: LMG3522R030 Other Parts Discussed in Thread: LMG3410R070 , LMG3410R150 , LMG3410R050 Hi team,
My customer is looking for a GaN solution and currently looking at competitor device TK12A60W.
I promoted LMG3522R030 to the customer but had trouble…
Part Number: LMG3522R030 I've had this question come up a lot when deciding between top-side and bottom-side cooled devices - what is the general recommendation for what type of cooling methodology is used? Devices that are considered are LMG3522…
Part Number: LMG3522R030 Hello team,
I am looking for the synbol and footprint for the above specified device in order to draw the schematic.
Regards,
Neha Agarwal
Part Number: LMG3522R030 hello,
I had some questions based on the d/s:
Section 8.5.1 states: “For reliable operation, the junction temperature of the device must also be limited to 125C.”
Section 6.5, Gan temperature fault – positive going…