Part Number: LMZM33603 Hi
My customer use LMZM33603 under Vin=15V, Vout=12V, Iout=1A, Fsw=900kHz and Ta=max_85℃.
However the recommending Vin_min is 15.6V in datasheet.
I think I can use LMZM33603 under customer's condition according to Figure 24 and…
Part Number: LMZM33603 Hi all,
I'm currently trying to create this part on our system, but I'm having some trouble with the footprint. I'm finding it extremely difficult to create the pads, as this a non-standard footprint. We use Solidworks PCB…
Part Number: LMZM33603 Hello,
This is my first attempt at a solder mask defined package, as I could not find an existing LMZM power module package in the eaglecad TI libraries. I have attached the land pattern supplied by the data sheet and also the package…
Part Number: LMZM33603 Hello,
I'm using this lmzm module in the smallest possible PCB size, with 0603 passives, configuring for 5 volts output at 3A max . I don't know much about the relationship between copper area and thermal performance in PCB's…
Part Number: LMZM33603 How do you enable the frequency foldback feature for the LMZM33603?
The datasheet mentions it on pages 12 and 13 but I cannot find anywhere that describes how to enable it.
Do you just leave the RT pin floating to enable the frequency…
Part Number: LMZM33603 We are using the LMZM33603 with a nominal 1.4A (2A peak) load, 24V VIN to 12V VOUT. The input caps are one 150uF AlPoly (Panasonic EEH-ZC1V151P) and two 4.7uF 50V X7R 1210 (Murata GRM32ER71H475KA88L), and the output caps are th…
Part Number: LMZM33603 In a design, I have four LZMZM33603 modules, which I want to synchronize. An FPGA drives the EN/SYNC input of each LMZM33603 using 3.3V signal levels. Each LMZM33603 module is enabled independently. For each LMZM33603, can I connect…
Part Number: LMZM33603 I want to make the output of the LMZM33603 dynamically-adjustable from about 5V to 12V, with a 24V supply. However, I'm not sure what to do about Cff. Making it dynamically adjustable is not really practical (unless it's simple…
Part Number: LMZM33603 Greetings,
is there any reason why the VIN, VOUT, PGND & AGND Planes are duplicated on 3 layers in the layout guideline?
Are they only used for thermal dissipation?
Thank you
Dear TI,
I want to test this module on my board, can you send PCB footprint for this package. As I really cann't finish it by myself, My email is 417296179@qq.com.
Thanks!